Integrated Electronics on Aluminum Nitride

Integrated Electronics on Aluminum Nitride

Author: Reet Chaudhuri

Publisher: Springer Nature

Published: 2022-12-06

Total Pages: 266

ISBN-13: 3031171993

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This thesis outlines the principles, device physics, and technological applications of electronics based on the ultra-wide bandgap semiconductor aluminum nitride. It discusses the basic principles of electrostatics and transport properties of polarization-induced two-dimensional electron and hole channels in semiconductor heterostructures based on aluminum nitride. It explains the discovery of high-density two-dimensional hole gases in undoped heterojunctions, and shows how these high conductivity n- and p-type channels are used for high performance nFETs and pFETs, along with wide bandgap RF, mm-wave, and CMOS applications. The thesis goes on to discuss how the several material advantages of aluminum nitride, such as its high thermal conductivity and piezoelectric coefficient, enable not just high performance of transistors, but also monolithic integration of passive elements such as high frequency filters, enabling a new form factor for integrated RF electronics.


Micro-Relay Technology for Energy-Efficient Integrated Circuits

Micro-Relay Technology for Energy-Efficient Integrated Circuits

Author: Hei Kam

Publisher: Springer

Published: 2014-10-16

Total Pages: 190

ISBN-13: 1493921282

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This volume describes the design of relay-based circuit systems from device fabrication to circuit micro-architectures. This book is ideal for both device engineers as well as circuit system designers, and highlights the importance of co-design across design hierarchies when trying to optimize system performance (in this case, energy-efficiency). The book will also appeal to researchers and engineers focused on semiconductor, integrated circuits, and energy efficient electronics.


Optoelectronic Devices

Optoelectronic Devices

Author: M Razeghi

Publisher: Elsevier

Published: 2004

Total Pages: 602

ISBN-13: 9780080444260

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Tremendous progress has been made in the last few years in the growth, doping and processing technologies of the wide bandgap semiconductors. As a result, this class of materials now holds significant promis for semiconductor electronics in a broad range of applications. The principal driver for the current revival of interest in III-V Nitrides is their potential use in high power, high temperature, high frequency and optical devices resistant to radiation damage. This book provides a wide number of optoelectronic applications of III-V nitrides and covers the entire process from growth to devices and applications making it essential reading for those working in the semiconductors or microelectronics. Broad review of optoelectronic applications of III-V nitrides


3D and Circuit Integration of MEMS

3D and Circuit Integration of MEMS

Author: Masayoshi Esashi

Publisher: John Wiley & Sons

Published: 2021-03-16

Total Pages: 528

ISBN-13: 3527823255

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Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.


Active Array Antennas for High Resolution Microwave Imaging Radar

Active Array Antennas for High Resolution Microwave Imaging Radar

Author: Jiaguo Lu

Publisher: Springer Nature

Published: 2023-05-04

Total Pages: 455

ISBN-13: 9819914752

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This book highlights the application of active array antennas in high-resolution microwave imaging radar systems. It introduces the basic principles, analytical methods, and performance parameters of active array antennas to achieve low profile, high efficiency, and lightweight. The book systematically elaborates the architecture, analysis, and engineering practice to achieve wideband, multi-band, multi-polarization, and common aperture in active array antennas. It explores hotspot technologies of digital array antennas, microwave photonic array antennas, and active packaging antennas. By presenting over 300 illustrations and diagrams, including schematic diagrams, block diagrams, relation diagrams, and breakdown drawings, the book enables a thorough understanding of the antenna array microsystem as the advanced phase of active array antennas and the direction of future R&D. The book is a good reference source for researchers and engineers interested in the engineering and implementation of microwave imaging radar systems and antenna technology.


Handbook of Integrated Circuit Industry

Handbook of Integrated Circuit Industry

Author: Yangyuan Wang

Publisher: Springer Nature

Published: 2023-12-29

Total Pages: 2006

ISBN-13: 9819928362

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Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.


Mechanical Engineers' Handbook, Volume 1

Mechanical Engineers' Handbook, Volume 1

Author: Myer Kutz

Publisher: John Wiley & Sons

Published: 2015-02-02

Total Pages: 1042

ISBN-13: 1118112822

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Full coverage of materials and mechanical design in engineering Mechanical Engineers' Handbook, Fourth Edition provides a quick guide to specialized areas you may encounter in your work, giving you access to the basics of each and pointing you toward trusted resources for further reading, if needed. The accessible information inside offers discussions, examples, and analyses of the topics covered. This first volume covers materials and mechanical design, giving you accessible and in-depth access to the most common topics you'll encounter in the discipline: carbon and alloy steels, stainless steels, aluminum alloys, copper and copper alloys, titanium alloys for design, nickel and its alloys, magnesium and its alloys, superalloys for design, composite materials, smart materials, electronic materials, viscosity measurement, and much more. Presents comprehensive coverage of materials and mechanical design Offers the option of being purchased as a four-book set or as single books, depending on your needs Comes in a subscription format through the Wiley Online Library and in electronic and custom formats Engineers at all levels of industry, government, or private consulting practice will find Mechanical Engineers' Handbook, Volume 1 a great resource they'll turn to repeatedly as a reference on the basics of materials and mechanical design.