Integrated Circuit Design and Technology
Author: M. J. Morant
Publisher: Springer
Published: 2013-12-01
Total Pages: 199
ISBN-13: 148997198X
DOWNLOAD EBOOKRead and Download eBook Full
Author: M. J. Morant
Publisher: Springer
Published: 2013-12-01
Total Pages: 199
ISBN-13: 148997198X
DOWNLOAD EBOOKAuthor: Luciano Lavagno
Publisher: CRC Press
Published: 2018-10-03
Total Pages: 608
ISBN-13: 1420007955
DOWNLOAD EBOOKPresenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Author: Vasilis F. Pavlidis
Publisher: Newnes
Published: 2017-07-04
Total Pages: 770
ISBN-13: 0124104843
DOWNLOAD EBOOKThree-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Emre Salman
Publisher: McGraw Hill Professional
Published: 2012-08-21
Total Pages: 738
ISBN-13: 0071635769
DOWNLOAD EBOOKThe latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Author: David A. Hodges
Publisher: McGraw-Hill Incorporated
Published: 2003
Total Pages: 580
ISBN-13: 9780071181648
DOWNLOAD EBOOKThe third edition of Hodges and Jackson’s Analysis and Design of Digital Integrated Circuits has been thoroughly revised and updated by a new co-author, Resve Saleh of the University of British Columbia. The new edition combines the approachability and concise nature of the Hodges and Jackson classic with a complete overhaul to bring the book into the 21st century. The new edition has replaced the emphasis on BiPolar with an emphasis on CMOS. The outdated MOS transistor model used throughout the book will be replaced with the now standard deep submicron model. The material on memory has been expanded and updated. As well the book now includes more on SPICE simulation and new problems that reflect recent technologies. The emphasis of the book is on design, but it does not neglect analysis and has as a goal to provide enough information so that a student can carry out analysis as well as be able to design a circuit. This book provides an excellent and balanced introduction to digital circuit design for both students and professionals.
Author: E. Wolfendale
Publisher: Elsevier
Published: 2013-10-22
Total Pages: 129
ISBN-13: 1483102491
DOWNLOAD EBOOKMOS Integral Circuit Design aims to help in the design of integrated circuits, especially large-scale ones, using MOS Technology through teaching of techniques, practical applications, and examples. The book covers topics such as design equation and process parameters; MOS static and dynamic circuits; logic design techniques, system partitioning, and layout techniques. Also featured are computer aids such as logic simulation and mask layout, as well as examples on simple MOS design. The text is recommended for electrical engineers who would like to know how to use MOS for integral circuit design.
Author: Yuan Xie
Publisher: Springer Science & Business Media
Published: 2009-12-02
Total Pages: 292
ISBN-13: 144190784X
DOWNLOAD EBOOKWe live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Author: Peter Shepherd
Publisher: McGraw-Hill Professional Publishing
Published: 1996
Total Pages: 248
ISBN-13:
DOWNLOAD EBOOKAll aspects of chip realization for both digital and analog circuits are covered. Electronics engineers are shown how to choose appropriate technololgy and circuit architecture, and plan the IC design. They'll gain expert information on power consaiderations, the advantages and disadvantages of each IC architecture, and aspects of design for testability.
Author: Kenneth William Martin
Publisher: Oxford University Press on Demand
Published: 2000
Total Pages: 543
ISBN-13: 9780195125849
DOWNLOAD EBOOKThe impact of digital integrated circuits on our modern society has been pervasive. They are the enabling technology of the current computer and information-technology revolution. This is largely true because of the immense amount of signal and computer processing that can be realized in a single integrated circuit; modern IC's may contain millions of logic gates. This text book is intended to take a reader having only a minimal background and knowledge in electronics to the point where they can design state-of-the-art digital integrated circuits. Designing high-performance digital integrated circuits requires expertise in many different areas. These include semiconductor physics, integrated circuit processing, transistor-level design, logic-level design, system-level design, testing, etc. Aspects of these topics are covered throughout this text, although the emphasis is on transistor-level design of digital integrated circuits and systems. This is in contrast to the perspective in many other texts, which takes a system-level or VLSI approach where transistor-level details are minimized. It is the author's belief that before system-level considerations can be properly evaluated, an in-depth tranisistor-level understanding must first be obtained. Important system-level considerations such as timing, pipe-lining, clock distribution, and system building blocks are covered in detail, but the emphasis on transistors first. Throughout the book, physical and intuitive explanations are given, and although mathematical quantitative analysis of many circuits have necessarily been presented, Martin has attempted not to "miss seeing the forest because of the trees". This book presents the critical underlying concepts without becoming entangled in tedious and over-complicated circuit analyses. It is intended for senior/graduate level students in electrical and computer engineering. This course assumes the Sedra/Smith Microelectronic Circuits course as a prerequisite.
Author: Stephen J. Gaul
Publisher: John Wiley & Sons
Published: 2019-12-03
Total Pages: 392
ISBN-13: 1118701879
DOWNLOAD EBOOKA practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.