New Serial Titles
Author:
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Published: 1990
Total Pages: 1860
ISBN-13:
DOWNLOAD EBOOKA union list of serials commencing publication after Dec. 31, 1949.
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Microjoining and Nanojoining
Author: Y N Zhou
Publisher: Elsevier
Published: 2008-03-27
Total Pages: 835
ISBN-13: 184569404X
DOWNLOAD EBOOKMany important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Expert Systems
Author: Cornelius T. Leondes
Publisher: Elsevier
Published: 2001-09-26
Total Pages: 2125
ISBN-13: 0080531458
DOWNLOAD EBOOKThis six-volume set presents cutting-edge advances and applications of expert systems. Because expert systems combine the expertise of engineers, computer scientists, and computer programmers, each group will benefit from buying this important reference work. An "expert system" is a knowledge-based computer system that emulates the decision-making ability of a human expert. The primary role of the expert system is to perform appropriate functions under the close supervision of the human, whose work is supported by that expert system. In the reverse, this same expert system can monitor and double check the human in the performance of a task. Human-computer interaction in our highly complex world requires the development of a wide array of expert systems. Expert systems techniques and applications are presented for a diverse array of topics including Experimental design and decision support The integration of machine learning with knowledge acquisition for the design of expert systems Process planning in design and manufacturing systems and process control applications Knowledge discovery in large-scale knowledge bases Robotic systems Geograhphic information systems Image analysis, recognition and interpretation Cellular automata methods for pattern recognition Real-time fault tolerant control systems CAD-based vision systems in pattern matching processes Financial systems Agricultural applications Medical diagnosis
Solder Joint Reliability
Author: John H. Lau
Publisher: Springer Science & Business Media
Published: 1991-05-31
Total Pages: 504
ISBN-13: 9780442002602
DOWNLOAD EBOOKLooks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Electronics Packaging Forum
Author: James E. Morris
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 459
ISBN-13: 9400904398
DOWNLOAD EBOOKEach May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Advanced Liquid Metal Cooling For Chip, Device And System
Author: Jing Liu
Publisher: World Scientific
Published: 2022-04-08
Total Pages: 961
ISBN-13: 9811245878
DOWNLOAD EBOOKThis compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
Concurrent Engineering
Author: Hamid R. Parsaei
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 501
ISBN-13: 1461530628
DOWNLOAD EBOOKIn the area of computer-integrated manufacturing, concurrent engineering is recognized as the manufacturing philosophy for the next decade.
Brazing and Soldering
Author: John J. Stephens
Publisher: ASM International
Published: 2006-01-01
Total Pages: 430
ISBN-13: 1615031170
DOWNLOAD EBOOKEnergy Research Abstracts
Author:
Publisher:
Published: 1990
Total Pages: 946
ISBN-13:
DOWNLOAD EBOOKArtificial Intelligence Techniques for Networked Manufacturing Enterprises Management
Author: Lyes Benyoucef
Publisher: Springer Science & Business Media
Published: 2010-05-10
Total Pages: 516
ISBN-13: 1849961190
DOWNLOAD EBOOKArtificial Intelligence Techniques for Networked Manufacturing Enterprises Management addresses prominent concepts and applications of AI technologies in the management of networked manufacturing enterprises. The aim of this book is to align latest practices, innovation and case studies with academic frameworks and theories, where AI techniques are used efficiently for networked manufacturing enterprises. More specifically, it includes the latest research results and projects at different levels addressing quick-response system, theoretical performance analysis, performance and capability demonstration. The role of emerging AI technologies in the modelling, evaluation and optimisation of networked enterprises’ activities at different decision levels is also covered. Artificial Intelligence Techniques for Networked Manufacturing Enterprises Management is a valuable guide for postgraduates and researchers in industrial engineering, computer science, automation and operations research.
