Hot Carrier Modeling in Metal-oxide-semiconductor Devices Using the Convective Scheme
Author: Deborah Ann Fixel
Publisher:
Published: 2007
Total Pages: 128
ISBN-13:
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Author: Deborah Ann Fixel
Publisher:
Published: 2007
Total Pages: 128
ISBN-13:
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Publisher:
Published: 1978
Total Pages: 990
ISBN-13:
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Publisher:
Published: 1988
Total Pages: 1142
ISBN-13:
DOWNLOAD EBOOKAuthor: United States. National Aeronautics and Space Administration. Scientific and Technical Information Branch
Publisher:
Published: 1985
Total Pages: 1080
ISBN-13:
DOWNLOAD EBOOKAuthor: National Institute of Standards and Technology (U.S.)
Publisher:
Published: 1991
Total Pages: 480
ISBN-13:
DOWNLOAD EBOOKAuthor: United States. National Bureau of Standards
Publisher:
Published: 1991
Total Pages: 480
ISBN-13:
DOWNLOAD EBOOKAuthor: Cheol Seong Hwang
Publisher: Springer Science & Business Media
Published: 2013-10-18
Total Pages: 266
ISBN-13: 146148054X
DOWNLOAD EBOOKOffering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Author: Alekseĭ Vasilʹevich Lykov
Publisher:
Published: 1967
Total Pages: 1242
ISBN-13:
DOWNLOAD EBOOKAuthor: Wladyslaw Grabinski
Publisher: Springer Science & Business Media
Published: 2010-07-20
Total Pages: 210
ISBN-13: 9048130468
DOWNLOAD EBOOKSemiconductor power electronics plays a dominant role due its increased efficiency and high reliability in various domains including the medium and high electrical drives, automotive and aircraft applications, electrical power conversion, etc. Power/HVMOS Devices Compact Modeling will cover very extensive range of topics related to the development and characterization power/high voltage (HV) semiconductor technologies as well as modeling and simulations of the power/HV devices and smart power integrated circuits (ICs). Emphasis is placed on the practical applications of the advanced semiconductor technologies and the device level compact/spice modeling. This book is intended to provide reference information by selected, leading authorities in their domain of expertise. They are representing both academia and industry. All of them have been chosen because of their intimate knowledge of their subjects as well as their ability to present them in an easily understandable manner.