A description of both the theory and practice of physical measurements that use high-sensitivity moiré - principally moiré interferometry. The focus here is on the mechanics and micromechanics of materials and structural elements and the book includes new studies published for the first time. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. All the methods can be applied for whole-field measurements on nearly and solid bodies. This reader-friendly book will serve engineers and scientists who are concerned with measurements of real phenomena, while also stimulating students to pursue the treasures of experimental analysis.
A comprehensive review of the field of materials that shield people and sensitive electronic devices from electromagnetic fields Advanced Materials for Electromagnetic Shielding offers a thorough review of the most recent advances in the processing and characterization of the electromagnetic shielding materials. In this groundbreaking book, the authors—noted experts in the field—discuss the fundamentals of shielding theory as well as the practice of electromagnetic field measuring techniques and systems. They also explore applications of shielding materials used as absorbers of electromagnetic radiation, or as magnetic shields and explore coverage of new advanced materials for EMI shielding in aerospace applications. In addition, the text contains methods of preparation and applicability of metal foams. This comprehensive text examines the influence of technology on the micro-and macrostructure of polymers enabling their use in screening technology, technologies of shielding materials based on textiles, and analyses of its effectiveness in screening. The book also details the method of producing nanowires and their applications in EM shielding. This important resource: Explores the burgeoning market of electromagnetic shielding materials as we create, depend upon, and are exposed to more electronic devices than ever Addresses the most comprehensive issues relating to electromagnetic fields Contains information on the manufacturing, characterization methods, and properties of materials used to protect against them Discusses the important characterization techniques compared with one another, thus allowing scientists to select the best approach to a problem Written for materials scientists, electrical and electronics engineers, physicists, and industrial researchers, Advanced Materials for Electromagnetic Shielding explores all aspects in the area of electromagnetic shielding materials and examines the current state-of-the-art and new challenges in this rapidly growing area.
Since its development in the late 1970s, the Moire Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moire Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis i
Where conventional testing and inspection techniques fail at the microscale, optical techniques provide a fast, robust, noninvasive, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems, Second Edition, extends and updates the first comprehensive survey of the most important optical measurement techniques to be successfully used for the inspection of microsystems. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image processing, image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser-Doppler vibrometry, digital holography, speckle metrology, spectroscopy, and sensor fusion technologies. They also examine modern approaches to data acquisition and processing, such as the determination of surface features and the estimation of uncertainty of measurement results. The book emphasizes the evaluation of various system properties and considers encapsulated components to increase quality and reliability. Numerous practical examples and illustrations of optical testing reinforce the concepts. Supplying effective tools for increased quality and reliability, this book Provides a comprehensive, up-to-date overview of optical techniques for the measurement and inspection of microsystems Discusses image correlation, displacement and strain measurement, electro-optic holography, and speckle metrology techniques Offers numerous practical examples and illustrations Includes calibration of optical measurement systems for the inspection of MEMS Presents the characterization of dynamics of MEMS
Fundamental measurement problems in engineering, mechanics, manufacturing, and physics are now being solved by powerful optical methods. This book presents a lucid, up-to-date discussion of these optical methods. Beginning from a firm base in modern optics, the book proceeds through relevant theory of interference and diffraction and integrates this theory with descriptions of laboratory techniques and apparatus. Among the techniques discussed are classical interferometry, photoelasticity, geometric moire, spatial filtering, moire interferometry, holography, holographic interferometry, laser speckle interferometry, and video-based speckle methods. By providing a firm base in the physical principles and at the same time allowing the reader to perform meaningful experiments related to the topic being studied, the book offers a unique user-oriented approach that will appeal to students, researchers and practising engineers.
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
The book presents in a clear, simple, straightforward, novel and unified manner the most used methods of experimental mechanics of solids for the determination of displacements, strains and stresses. Emphasis is given on the principles of operation of the various methods, not in their applications to engineering problems. The book is divided into sixteen chapters which include strain gages, basic optics, geometric and interferometric moiré, optical methods (photoelasticity, interferometry, holography, caustics, speckle methods, digital image correlation), thermoelastic stress analysis, indentation, optical fibers, nondestructive testing, and residual stresses. The book will be used not only as a learning tool, but as a basis on which the researcher, the engineer, the experimentalist, the student can develop their new own ideas to promote research in experimental mechanics of solids.
Optical methods, stimulated by the advent of inexpensive and reliable lasers, are assuming an increasingly important role in the field of engineering metrology. Requiring only a basic knowledge of optics, this text provides a compendium of practical information prepared by leaders in the field.
These volumes contain contributions from a conference on the themes of measurement and prediction of residual stress in railroad rails. The first volume features practical railway experience and laboratory tests, while the second one presents theoretical and numerical analyses.
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
