In this review volume, the editors have included the state-of-the-art research and development in nano composites, and optical electronics written by experts in the field. In addition, it also covers applications for emerging technologies in High-Speed Electronics.In summary, topics covered in this volume includes various aspects of high performance materials and devices for implementing High-Speed Electronic systems.
Advanced High Speed Devices covers five areas of advanced device technology: terahertz and high speed electronics, ultraviolet emitters and detectors, advanced III-V field effect transistors, III-N materials and devices, and SiC devices. These emerging areas have attracted a lot of attention and the up-to-date results presented in the book will be of interest to most device and electronics engineers and scientists. The contributors range from prominent academics, such as Professor Lester Eastman, to key US Government scientists, such as Dr Michael Wraback.
In this volume, we have put together papers spanning a broad range — from the area of modeling of strain and misfit dislocation densities, microwave absorption characteristics of nanocomposites, to X-ray diffraction studies.Specific topics in this volume include:In summary, papers selected in this volume cover various aspects of high performance logic and circuits for high-speed electronic systems.
Transfer printing (TP) is a class of techniques for the deterministic assembly of disparate micro/nanomaterials into functional devices, and has become an emerging suite of technologies for micro/nanofabrication. Systems enabled by transfer printing range from complex molecular-scale materials, to high-performance hard materials, to fully integrated devices. A variety of sub-techniques for different purposes have grown significantly in the past decade, leading to non-conventional electronics, optoelectronics, photovoltaics, and photonics, and enabling the development of non-planar and flexible electronics.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.Transfer Printing Technologies and Applications is a complete guide to transfer printing techniques and their cutting-edge applications. The first section of the book provides a solid grounding in transfer printing methods and the fundamentals behind these technologies. The second part of the book focuses on state-of-the-art applications enabled by transfer printing techniques, including areas such as flexible sensors, flexible transistors, wearable devices, thin film-based energy systems, flexible displays, microLED-based displays, metal films, and more. A concluding chapter addresses current challenges and future opportunities in this innovative field.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.This book is of interest to researchers and advanced students across nanotechnology, materials science, electrical engineering, mechanical engineering, chemistry, and biomedicine, as well as scientists, engineers, and R&D professionals involved with nanomaterials, micro- or nano-fabrication, microelectromechanical systems (MEMS), display technology, biotechnology, and devices. Highlights breakthrough results and systems enabled by novel TP techniques. Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques. Highlights breakthrough results and systems enabled by novel TP techniques. - Examines a range of transfer printing technologies and their specific features for different applications - Highlights breakthrough results and systems enabled by novel TP techniques - Offers an insightful outlook into trends and future directions in each sub-area of transfer printing
A collection of abstracts for talks presented at the 2014 CMOS Emerging Technologies Research Symposium in Grenoble, France, July 6-8, 2014. The CMOS Emerging Technologies Research Symposium is a research and business event for those who want to discuss and find out about new exciting high tech opportunities. The conference provides researchers, companies and academic institutions with a platform for showcasing their technology, innovations, products and services. By bringing together people from all areas of the high tech arena, we create a stimulating common ground for exploring collaborations and encouraging discussions on emerging technologies.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
