Heterogeneous Integrations
Heterogeneous Integrations

Author: John H. Lau

Publisher: Springer

Published: 2019-04-03

Total Pages: 381

ISBN-13: 9811372241

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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging

Author: John H. Lau

Publisher: Springer Nature

Published: 2023-03-27

Total Pages: 542

ISBN-13: 9811999171

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The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

TSV 3D RF Integration
TSV 3D RF Integration

Author: Shenglin Ma

Publisher: Elsevier

Published: 2022-04-27

Total Pages: 294

ISBN-13: 0323996035

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TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology

Semiconductor Advanced Packaging
Semiconductor Advanced Packaging

Author: John H. Lau

Publisher: Springer Nature

Published: 2021-05-17

Total Pages: 513

ISBN-13: 9811613761

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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging

Author: John H. Lau

Publisher: Springer

Published: 2018-04-05

Total Pages: 319

ISBN-13: 9811088845

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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

3D Integration in VLSI Circuits
3D Integration in VLSI Circuits

Author: Katsuyuki Sakuma

Publisher: CRC Press

Published: 2018-04-17

Total Pages: 217

ISBN-13: 1351779834

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

High Mobility Materials for CMOS Applications
High Mobility Materials for CMOS Applications

Author: Nadine Collaert

Publisher: Woodhead Publishing

Published: 2018-06-29

Total Pages: 390

ISBN-13: 0081020627

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High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and beyond, however, severe concerns with power dissipation and performance are arising, hence the need for this timely work on the advantages and challenges of the technology. - Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations - Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability - Provides a broad overview of the topic, from materials integration to circuits

The Anatomy of Post-Communist Regimes
The Anatomy of Post-Communist Regimes

Author: Bálint Magyar

Publisher: Central European University Press

Published: 2021-02-20

Total Pages: 834

ISBN-13: 9633863708

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Offering a single, coherent framework of the political, economic, and social phenomena that characterize post-communist regimes, this is the most comprehensive work on the subject to date. Focusing on Central Europe, the post-Soviet countries and China, the study provides a systematic mapping of possible post-communist trajectories. At exploring the structural foundations of post-communist regime development, the work discusses the types of state, with an emphasis on informality and patronalism; the variety of actors in the political, economic, and communal spheres; the ways autocrats neutralize media, elections, etc. The analysis embraces the color revolutions of civil resistance (as in Georgia and in Ukraine) and the defensive mechanisms of democracy and autocracy; the evolution of corruption and the workings of “relational economy”; an analysis of China as “market-exploiting dictatorship”; the sociology of “clientage society”; and the instrumental use of ideology, with an emphasis on populism. Beyond a cataloguing of phenomena—actors, institutions, and dynamics of post-communist democracies, autocracies, and dictatorships—Magyar and Madlovics also conceptualize everything as building blocks to a larger, coherent structure: a new language for post-communist regimes. While being the most definitive book on the topic, the book is nevertheless written in an accessible style suitable for both beginners who wish to understand the logic of post-communism and scholars who are interested in original contributions to comparative regime theory. The book is equipped with QR codes that link to www.postcommunistregimes.com, which contains interactive, 3D supplementary material for teaching.

Die-stacking Architecture
Die-stacking Architecture

Author: Yuan Xie

Publisher: Springer Nature

Published: 2022-05-31

Total Pages: 113

ISBN-13: 3031017471

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The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.