Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author: Karl J. Puttlitz

Publisher: CRC Press

Published: 2004-02-27

Total Pages: 1044

ISBN-13: 082475249X

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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author: Karl J. Puttlitz

Publisher: CRC Press

Published: 2004-02-27

Total Pages: 1044

ISBN-13: 0203021487

DOWNLOAD EBOOK

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author: Karl J. Puttlitz

Publisher: CRC Press

Published: 2004-02-27

Total Pages: 1048

ISBN-13: 9780824748708

DOWNLOAD EBOOK

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Lead-Free Electronic Solders
Lead-Free Electronic Solders

Author: KV Subramanian

Publisher: Springer Science & Business Media

Published: 2007-06-28

Total Pages: 370

ISBN-13: 0387484337

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Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints

Author: John H. Lau

Publisher: Springer Nature

Published: 2020-05-29

Total Pages: 545

ISBN-13: 9811539200

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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Fundamentals of Lead-Free Solder Interconnect Technology
Fundamentals of Lead-Free Solder Interconnect Technology

Author: Tae-Kyu Lee

Publisher: Springer

Published: 2014-11-05

Total Pages: 266

ISBN-13: 1461492661

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Lead-Free Soldering in Electronics
Lead-Free Soldering in Electronics

Author: Katsuaki Suganuma

Publisher: CRC Press

Published: 2003-12-11

Total Pages: 355

ISBN-13: 0824758595

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Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author: Ephraim Suhir

Publisher: Springer Science & Business Media

Published: 2007-05-26

Total Pages: 1471

ISBN-13: 0387329897

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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Dielectric Films for Advanced Microelectronics
Dielectric Films for Advanced Microelectronics

Author: Mikhail Baklanov

Publisher: John Wiley & Sons

Published: 2007-04-04

Total Pages: 508

ISBN-13: 0470065419

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The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.