Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are described. The book also underscores testing for quality. Reliability, component parts testing, production processes, and the packaged and unpackaged assemblies are discussed. The text also examines standardization of electronics manufacture. Reference to standards, standards of organizations and bodies, assessed quality of companies, and setting up of company standards are considered. The book also discusses the process of selling to the Ministry of Defense. Procurement executive, quality assurance, and procurement executive policies and procedures are clarified. The handbook is a helpful reference for readers wanting to study the processes involved in electronic assembling.
This single source reference offers a pragmatic and accessible approach to the basic methods and procedures used in the manufacturing and design of modern electronic products. Providing a stategic yet simplified layout, this handbook is set up with an eye toward maximizing productivity in each phase of the eletronics manufacturing process. Not only does this handbook inform the reader on vital issues concerning electronics manufacturing and design, it also provides practical insight and will be of essential use to manufacturing and process engineers in electronics and aerospace manufacturing. In addition, electronics packaging engineers and electronics manufacturing managers and supervisors will gain a wealth of knowledge.
"Circuit Design Laws: A Handbook for Electronic Assembly" is an essential guide for anyone involved in the design, assembly, and production of electronic circuits. This comprehensive book serves as a one-stop resource, providing readers with a deep understanding of the fundamental principles, best practices, and industry standards related to circuit design and electronic assembly. The book begins with an introduction to the basic concepts of circuit design, including an overview of electronic components, circuit analysis, and common design techniques. It emphasizes the importance of adhering to design laws and industry standards to ensure the safety, functionality, and reliability of electronic assemblies. As readers navigate through the chapters, they will delve into the different types of circuit design laws and how they apply to specific aspects of electronic assembly. This includes laws pertaining to power distribution, signal integrity, electromagnetic compatibility (EMC), thermal management, and safety considerations. Each law is explained in detail, along with practical examples and case studies that illustrate their application in real-world scenarios. The handbook also covers essential topics such as component selection and placement, soldering techniques, trace routing guidelines, and manufacturing processes. It emphasizes the importance of design for manufacturability (DFM) and provides valuable insights on how to optimize circuit designs for efficient and cost-effective assembly. One of the key strengths of "Circuit Design Laws" is its practical approach. Throughout the book, readers will find step-by-step instructions, design checklists, and troubleshooting tips to help them apply these design laws effectively in their own projects. The book also includes a comprehensive set of design templates and tools that can be used as a starting point for various types of circuit designs. "Circuit Design Laws: A Handbook for Electronic Assembly" is not just a reference book but also a valuable tool for professionals and enthusiasts alike. With its clear explanations, practical examples, and comprehensive coverage of circuit design laws, this handbook empowers readers to create robust and reliable electronic assemblies that meet industry standards and perform optimally in their intended applications. By having this book by their side, designers, engineers, hobbyists, and students alike will be well-equipped to turn their circuit designs into successful, market-ready products while adhering to the essential laws and principles of electronic assembly.
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment
