High c oxide superconductors such as Bi(Pb)-Sr-Ca-Cu-O (BSCCO) and Y-Ba-Cu-O (YBCO) systems are usually fabricated by sintering given mixtures of raw materials. Generally, sintering processing takes a longer heating time and the products are mechanically low strength and cannot be formed into complex shapes such as a coil, a curved fine tube or a fine rod. Another way to produce the ceramics is a glass-ceramic process in which the glasses prepared by melt-quenching are reheated for crystallization. A given mixture of raw materials in BSCCO is easily melted and quenched to form a given shape of glass, while that in YBCO is not glassified.This invaluable book has been written by authors from five countries. It presents a unique way to fabricate superconducting ceramics in BSCCO by glass-ceramic processing.
Papers by leading engineers and scientists in the field report the latest advances in low temperature materials science and technology and set priorities for new research. The topics covered include general superconductor theory, measurement, and processing; low temperature superconductors; high tem
Contains papers from a May 1997 symposium, divided into sections on processing and single crystal growth, crystal structure and synthesis, phase equilibria and crystal growth, films and applications, and wires and composites. Papers address current processing techniques and methods for high temperat
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
