Adhesion in Microelectronics

Adhesion in Microelectronics

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2014-08-25

Total Pages: 293

ISBN-13: 1118831349

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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings


Polymer Interface and Adhesion

Polymer Interface and Adhesion

Author: Wu

Publisher: Routledge

Published: 2017-11-22

Total Pages: 654

ISBN-13: 1351423525

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Poly mer Interface and Adhesion provides the critical basis for further advancement in thisfield. Combining the principles of interfacial science, rheology, stress analysis, and fracturemechanics, the book teaches a new approach to the analysis of long standing problemssuch as: how is the interface formed; what are its physical and mechanical properties;and how does the interface modify the stress field and fracture strength of the material.The book offers many outstanding features, including extensive listings of pertinent references,exhaustive tabulations of the interfacial properties of polymers, critical reviews ofthe many conflicting theories, and complete discussions of coupling agents, adhesion promotion,and surface modifications. Emphasis is placed on physical concepts and mechanisms,using clear, understandable mathematics.Polymer Interface and Adhesion promotes a more thorough understanding of the physical,mechanical, and adhesive properties of multiphase, polymer systems. Polymer scientistsand engineers, surface chemists, materials scientists, rheologists, as well as chemical andmechanical engineers interested in the research, development or industrial applications ofpolymers, plastics, fibers, coatings, adhesives, and composites need this important newsource book.


Engineered Interfaces in Fiber Reinforced Composites

Engineered Interfaces in Fiber Reinforced Composites

Author: Jang-Kyo Kim

Publisher: Elsevier

Published: 1998-10-21

Total Pages: 416

ISBN-13: 0080530974

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The study and application of composite materials are a truly interdisciplinary endeavour that has been enriched by contributions from chemistry, physics, materials science, mechanics and manufacturing engineering. The understanding of the interface (or interphase) in composites is the central point of this interdisciplinary effort. From the early development of composite materials of various nature, the optimization of the interface has been of major importance. While there are many reference books available on composite materials, few of them deal specifically with the science and mechanics of the interface of fiber reinforced composites. Further, many recent advances devoted solely to research in composite interfaces have been scattered in a variety of published literature and have yet to be assembled in a readily accessible form. To this end this book is an attempt to bring together recent developments in the field, both from the materials science and mechanics perspective, in a single convenient volume.The central theme of the book is tailoring the interface properties to optimise the mechanical peformance and structural integrity of composites with enhanced strength/stiffness and fracture toughness (or specific fracture resistance). It deals mainly with interfaces in advanced composites made from high performance fibers, such as glass, carbon, aramid, ultra high modulus polyethylene and some inorganic (e.g. B/W, A12O3, SiC) fibers, and matrix materials encompassing polymers, metals/alloys and ceramics. The book is intended to provide a comprehensive treatment of composite interfaces in such a way that it should be of interest to materials scientists, technologists and practising engineers, as well as graduate students and their supervisors in advanced composites. We hope that this book will also serve as a valuable source of reference to all those involved in the design and research of composite interfaces.The book contains eight chapters of discussions on microstructure-property relationships with underlying fundamental mechanics principles. In Chapter 1, an introduction is given to the nature and definition of interfaces in fiber reinforced composites. Chapter 2 is devoted to the mechanisms of adhesion which are specific to each fiber-matrix system, and the physio-chemical characterization of the interface with regard to the origin of adhesion. The experimental techniques that have been developed to assess the fiber-matrix interface bond quality on a microscopic scale are presented in Chapter 3, along with the techniques of measuring interlaminar/intralaminar strengths and fracture toughness using bulk composite laminates. The applicability and limitations associated with loading geometry and interpretation of test data are compared. Chapter 4 presents comprehensive theoretical analyses based on shear-lag models of the single fiber composite tests, with particular interest being placed on the interface debond process and the nature of the fiber-matrix interfacial bonding. Chapter 5 is devoted to reviewing current techniques of fiber surface treatments which have been devised to improve the bond strength and the fiber-matrix compatibility/stability during the manufacturing processes of composites. The micro-failure mechanisms and their associated theories of fracture toughness of composites are discussed in Chapter 6. The roles of the interface and its effects on the mechanical performance of fiber composites are addressed from several viewpoints. Recent research efforts to augment the transverse and interlaminar fracture toughness by means of controlled interfaces are presented in Chapters 7 and 8.


Fundamentals of Pressure Sensitivity

Fundamentals of Pressure Sensitivity

Author: Istvan Benedek

Publisher: CRC Press

Published: 2008-10-28

Total Pages: 371

ISBN-13: 1420059386

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Discussing the definition of pressure sensitivity and characterization of pressure-sensitive behavior, Volume 1 of the Handbook of Pressure-Sensitive Adhesives and Products presents the underlying theory beh


Progress in Adhesion and Adhesives, Volume 2

Progress in Adhesion and Adhesives, Volume 2

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2017-06-23

Total Pages: 458

ISBN-13: 1119407516

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With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.


Molecular Adhesion and Its Applications

Molecular Adhesion and Its Applications

Author: Kevin Kendall

Publisher: Springer Science & Business Media

Published: 2007-05-08

Total Pages: 433

ISBN-13: 0306484064

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At the beginning of the twentieth century, engineers and technologists would have recognized the importance of adhesion in two main aspects: First, in the display of friction between surfaces — at the time a topic of growing importance to engineers; the second in crafts requiring the joining of materials — principally wood—to form engineering structures. While physical scientists would have admitted the adhesive properties of glues, gels, and certain pastes, they regarded them as materials of uncertain formulation, too impure to be amenable to precise experiment. Biological scientists were aware also of adhesive phenomena, but the science was supported by documentation rather than understanding. By the end of the century, adhesion and adhesives were playing a crucial and deliberate role in the formulation of materials, in the design and manufacture of engineering structures without weakening rivets or pins, and in the use of thin sections and intricate shapes. Miniaturization down to the micro- and now to the nano-level of mechanical, electrical, electronic, and optical devices relied heavily on the understanding and the technology of adhesion. For most of the century, physical scientists were aware that the states of matter, whether gas, liquid, or solid, were determined by the competition between thermal energy and int- molecular binding forces. Then the solid state had to be differentiated into crystals, amorphous glasses, metals, etc. , so the importance of the molecular attractions in determining stiffness and strength became clearer.


Ceramics Science and Technology, Volume 3

Ceramics Science and Technology, Volume 3

Author: Ralf Riedel

Publisher: John Wiley & Sons

Published: 2011-12-15

Total Pages: 554

ISBN-13: 3527631968

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Although ceramics have been known to mankind literally for millennia, research has never ceased. Apart from the classic uses as a bulk material in pottery, construction, and decoration, the latter half of the twentieth century saw an explosive growth of application fields, such as electrical and thermal insulators, wear-resistant bearings, surface coatings, lightweight armour, or aerospace materials. In addition to plain, hard solids, modern ceramics come in many new guises such as fabrics, ultrathin films, microstructures and hybrid composites. Built on the solid foundations laid down by the 20-volume series Materials Science and Technology, Ceramics Science and Technology picks out this exciting material class and illuminates it from all sides. Materials scientists, engineers, chemists, biochemists, physicists and medical researchers alike will find this work a treasure trove for a wide range of ceramics knowledge from theory and fundamentals to practical approaches and problem solutions.