Adhesion in Microelectronics

Adhesion in Microelectronics

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2014-08-25

Total Pages: 293

ISBN-13: 1118831349

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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings


Engineered Interfaces in Fiber Reinforced Composites

Engineered Interfaces in Fiber Reinforced Composites

Author: Jang-Kyo Kim

Publisher: Elsevier

Published: 1998-10-21

Total Pages: 416

ISBN-13: 0080530974

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The study and application of composite materials are a truly interdisciplinary endeavour that has been enriched by contributions from chemistry, physics, materials science, mechanics and manufacturing engineering. The understanding of the interface (or interphase) in composites is the central point of this interdisciplinary effort. From the early development of composite materials of various nature, the optimization of the interface has been of major importance. While there are many reference books available on composite materials, few of them deal specifically with the science and mechanics of the interface of fiber reinforced composites. Further, many recent advances devoted solely to research in composite interfaces have been scattered in a variety of published literature and have yet to be assembled in a readily accessible form. To this end this book is an attempt to bring together recent developments in the field, both from the materials science and mechanics perspective, in a single convenient volume. The central theme of the book is tailoring the interface properties to optimise the mechanical peformance and structural integrity of composites with enhanced strength/stiffness and fracture toughness (or specific fracture resistance). It deals mainly with interfaces in advanced composites made from high performance fibers, such as glass, carbon, aramid, ultra high modulus polyethylene and some inorganic (e.g. B/W, A12O3, SiC) fibers, and matrix materials encompassing polymers, metals/alloys and ceramics. The book is intended to provide a comprehensive treatment of composite interfaces in such a way that it should be of interest to materials scientists, technologists and practising engineers, as well as graduate students and their supervisors in advanced composites. We hope that this book will also serve as a valuable source of reference to all those involved in the design and research of composite interfaces. The book contains eight chapters of discussions on microstructure-property relationships with underlying fundamental mechanics principles. In Chapter 1, an introduction is given to the nature and definition of interfaces in fiber reinforced composites. Chapter 2 is devoted to the mechanisms of adhesion which are specific to each fiber-matrix system, and the physio-chemical characterization of the interface with regard to the origin of adhesion. The experimental techniques that have been developed to assess the fiber-matrix interface bond quality on a microscopic scale are presented in Chapter 3, along with the techniques of measuring interlaminar/intralaminar strengths and fracture toughness using bulk composite laminates. The applicability and limitations associated with loading geometry and interpretation of test data are compared. Chapter 4 presents comprehensive theoretical analyses based on shear-lag models of the single fiber composite tests, with particular interest being placed on the interface debond process and the nature of the fiber-matrix interfacial bonding. Chapter 5 is devoted to reviewing current techniques of fiber surface treatments which have been devised to improve the bond strength and the fiber-matrix compatibility/stability during the manufacturing processes of composites. The micro-failure mechanisms and their associated theories of fracture toughness of composites are discussed in Chapter 6. The roles of the interface and its effects on the mechanical performance of fiber composites are addressed from several viewpoints. Recent research efforts to augment the transverse and interlaminar fracture toughness by means of controlled interfaces are presented in Chapters 7 and 8.


Polymer Interface and Adhesion

Polymer Interface and Adhesion

Author: Wu

Publisher: Routledge

Published: 2017-11-22

Total Pages: 654

ISBN-13: 1351423525

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Poly mer Interface and Adhesion provides the critical basis for further advancement in thisfield. Combining the principles of interfacial science, rheology, stress analysis, and fracturemechanics, the book teaches a new approach to the analysis of long standing problemssuch as: how is the interface formed; what are its physical and mechanical properties;and how does the interface modify the stress field and fracture strength of the material.The book offers many outstanding features, including extensive listings of pertinent references,exhaustive tabulations of the interfacial properties of polymers, critical reviews ofthe many conflicting theories, and complete discussions of coupling agents, adhesion promotion,and surface modifications. Emphasis is placed on physical concepts and mechanisms,using clear, understandable mathematics.Polymer Interface and Adhesion promotes a more thorough understanding of the physical,mechanical, and adhesive properties of multiphase, polymer systems. Polymer scientistsand engineers, surface chemists, materials scientists, rheologists, as well as chemical andmechanical engineers interested in the research, development or industrial applications ofpolymers, plastics, fibers, coatings, adhesives, and composites need this important newsource book.


Springer Handbook of Nanotechnology

Springer Handbook of Nanotechnology

Author: Bharat Bhushan

Publisher: Springer Science & Business Media

Published: 2010-04-23

Total Pages: 1968

ISBN-13: 3642025250

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Since 2004 and with the 2nd edition in 2006, the Springer Handbook of Nanotechnology has established itself as the definitive reference in the nanoscience and nanotechnology area. It integrates the knowledge from nanofabrication, nanodevices, nanomechanics, Nanotribology, materials science, and reliability engineering in just one volume. Beside the presentation of nanostructures, micro/nanofabrication, and micro/nanodevices, special emphasis is on scanning probe microscopy, nanotribology and nanomechanics, molecularly thick films, industrial applications and microdevice reliability, and on social aspects. In its 3rd edition, the book grew from 8 to 9 parts now including a part with chapters on biomimetics. More information is added to such fields as bionanotechnology, nanorobotics, and (bio)MEMS/NEMS, bio/nanotribology and bio/nanomechanics. The book is organized by an experienced editor with a universal knowledge and written by an international team of over 150 distinguished experts. It addresses mechanical and electrical engineers, materials scientists, physicists and chemists who work either in the nano area or in a field that is or will be influenced by this new key technology.