This book deals with primarily with reliable and faul-tolerant circuit design and evaluation techniques for RAMS. It examines both the manufacturing faul-tolerance (e.g. self-repair at the time of manufacturing) and online and field-related fault-tolerance (e.g. error-correction). It talks a lot about important techniques and requirements, and explains what needs to be done and why for each of the techniques.
Nanoelectronics and Photonics provides a fundamental description of the core elements and problems of advanced and future information technology. The authoritative book collects a series of tutorial chapters from leaders in the field covering fundamental topics from materials to devices and system architecture, and bridges the fundamental laws of physics and chemistry of materials at the atomic scale with device and circuit design and performance requirements.
From ASICs to SOCs: A Practical Approach, by Farzad Nekoogar and Faranak Nekoogar, covers the techniques, principles, and everyday realities of designing ASICs and SOCs. Material includes current issues in the field, front-end and back-end designs, integration of IPs on SOC designs, and low-power design techniques and methodologies. Appropriate for practicing chip designers as well as graduate students in electrical engineering.
& Describes the engineering needs addressed by the individual EDA tools and covers EDA from both the provider and user viewpoints. & & Learn the importance of marketing and business trends in the EDA industry. & & The EDA consortium is made up of major corporations including SUN, HP, and Intel.
This advanced-level reference presents a complete and unified theory of signal propagation for all metallic media from cables to pcb traces to chips. It includes numerous examples, pictures, tables and wide-ranging discussion of the high-speed properties of transmission lines.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.
