Environmental stress screening (ESS) has become one of the primary approaches in the modern electronic industry to precipitate and eliminate latent or hidden defects in electronic products which are introduced mainly during the manufacturing, assembling and packaging processes. Temperature cycling, plus random vibration (shaking and baking) are the primary processes of ESS. This text presents coverage of the subject, from basic concepts and the historical evolution of ESS, to the statistical and physical quantification of ESS.
Why read this book on Environmental Stress Screening ? If you are working in the electronic manufacturing industry and you have heard the questions : "Why did it fail in the field and not in the factory ?" The answer to this question is there was not a proper ESS program developed for this product. A good ESS program is develop from the ground up and the fallout data is tracked. The fallout data is used to alter the present ESS program. This new /altered program is tailored to the hardware and usually is less costly and should improve the product reliability. "Why can't we use the same ESS program as the other guy ?" The answer to this is you can, if you are manufacturing the exact same product. If this is the case, you must be working with the other guy. A different product requires a different ESS program. Or If you are working in the electronic manufacturing industry and you have heard the statements : "I won't do ESS, it's going to cost too much." Can you put a price on field returns or lost contracts because of poor quality ? "I don't need to ESS, I'll just be more careful during manufacturing." You can be as careful as you want. If you don't weed out the Latent defects the time bomb is ticking. Or (worst case condition) If you are working in the electronic manufacturing industry and you have heard the front door being locked for the last time because of poor Quality hardware being shipped to the customer: Unfortunately if this happens it is too late to do anything. Hopefully you will develop a strong ESS program that is cost effective, apply dynamic management of the ESS program by analyzing the fallout data and last but not least - use common sense.
This book presents comprehensive coverage of Environmental Stress Screening from basic concepts and the historical evolution of ESS, to the statistical and physical quantification of ESS. Covers the design-of-experiments approach to multiple-stress screening evaluation; ESS planning, tailoring, monitoring, control and evaluation; and ESS case histories.
Electrical Engineering Accelerated Stress Testing Handbook Guide for Achieving Quality Products As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: * Theoretical basis for AST * General AST best practices * AST design and manufacturing processes * AST equipment and techniques * AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.
A guide and reference to product reliability testing, this volume covers various steps from planning and test selection to test procedure and results analysis. It delivers information on a variety of distributions, including the Chi-Square, Exponential, Normal, Lognormal, Weibull, Gamma, and others.
Expanding on the coverage provided in Volume 1, this volume covers the prediction of equipment and system reliability for the series, parallel, standby, and conditional function configuration cases and discusses the prediction of the reliability of complex components, equipment, and systems with multimode function and logic, among others.
Crandall's Power Supply Testing Handbook comes into the marketplace at an optimum time. Now, more than ever, there is an urgency for a comprehensive handbook on power supply testing that will fulfill the reference needs of the wide variety of professionals testing power supplies, including designers, manufacturers, purchasers, and field service organizations.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
This book is intended for the engineer or engineering student with little or no prior background in reliability. Its purpose is to provide the background material and guidance necessary to comprehend and carry out all the tasks associated with a reliability program from specification generation to final demonstration of reliability achieved. Most available texts on reliability concentrate on the mathematics and statistics used for reliability analysis, evaluation, and demonstration. They are more often suited more for the professional with a heavier mathematical background that most engineers have, and more often than not, ignore or pay short-shrift to basic engineering design and organizational efforts associated with a reliability program. A reliability engineer must be familiar with both the mathematics and engineering aspects of a reliability program. This text: 1. Describes the mathematics needed for reliability analysis, evaluation, and demonstration commensurate with an engineer's background. 2. Provides background material, guidance, and references necessary to the structure and implementation of a reliability program including: • identification of the reliability standards in most common use • how to generate and respond to a reliability specification • how reliability can be increased • the tasks which make up a reliability program and how to judge the need and scope of each; how each is commonly performed; caution and comments about their application.
The phrase "high technology" is perhaps one of the more overused descriptions in our technical vocabulary. It is a phrase generally reserved for discussion of integrated circuits, fiber optics, satellite systems, and computers. Few people would associate high technology with vacuum tubes. The notion that vacuum tube construction is more art than science may have been true 10 or 20 years ago, but today it's a different story. The demand on the part of industry for tubes capable of higher operating power and frequency, and the economic necessity for tubes that provide greater efficiency and reliability, have moved power tube manufacturers into the high-tech arena. Advancements in tube design and construction have given end users new transmit ters and RF generators that allow industry to grow and prosper. If you bring up the subject of vacuum tubes to someone who has never worked on a transmitter, you are likely to get a blank stare and a question: "Do they make those anymore?" Although receiving tubes have disappeared from the scene, power tubes are alive and well and are performing vital functions in thousands of divergent applications. Solid-state and tube technologies each have their place, each with its strengths and weaknesses. Tube design and development, although accompanied by less fanfare, is advanc ing as are developments in solid-state technology. Power tubes today are designed with an eye toward high operating efficiency and high gain/bandwidth properties.
