Eleventh Electronic Packaging Technology Conference
Author:
Publisher: IEEE Computer Society Press
Published: 2009
Total Pages: 1005
ISBN-13: 9781424451005
DOWNLOAD EBOOKRead and Download eBook Full
Author:
Publisher: IEEE Computer Society Press
Published: 2009
Total Pages: 1005
ISBN-13: 9781424451005
DOWNLOAD EBOOKAuthor: Keyun Bi
Publisher:
Published: 2010
Total Pages: 723
ISBN-13:
DOWNLOAD EBOOKAuthor: Components, Packaging, and Manufacturing Technology Society
Publisher:
Published: 2009
Total Pages: 511
ISBN-13:
DOWNLOAD EBOOKAuthor: IEEE Staff
Publisher:
Published: 2010
Total Pages:
ISBN-13: 9781424481408
DOWNLOAD EBOOKAuthor: Tianchun Ye
Publisher:
Published: 2018
Total Pages:
ISBN-13: 9781538663868
DOWNLOAD EBOOKAuthor: IEEE Staff
Publisher:
Published: 2009
Total Pages:
ISBN-13: 9781424450992
DOWNLOAD EBOOKAuthor: International Electronics Packaging Society
Publisher:
Published: 1991
Total Pages: 1134
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 2011
Total Pages:
ISBN-13: 9781457717703
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Publisher:
Published: 2011
Total Pages: 0
ISBN-13:
DOWNLOAD EBOOKAuthor: James E. Morris
Publisher: Springer
Published: 2018-09-22
Total Pages: 1007
ISBN-13: 3319903624
DOWNLOAD EBOOKThis book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.