VLSI and Post-CMOS Electronics
VLSI and Post-CMOS Electronics

Author: Rohit Dhiman

Publisher: Institution of Engineering and Technology

Published: 2019-09-30

Total Pages: 369

ISBN-13: 1839530510

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VLSI, or Very-Large-Scale-Integration, is the practice of combining billions of transistors to create an integrated circuit. At present, VLSI circuits are realised using CMOS technology. However, the demand for ever smaller, more efficient circuits is now pushing the limits of CMOS. Post-CMOS refers to the possible future digital logic technologies beyond the CMOS scaling limits. This 2-volume set addresses the current state of the art in VLSI technologies and presents potential options for post-CMOS processes.

Electronic Packaging
Electronic Packaging

Author: John H. Lau

Publisher: McGraw-Hill Professional Publishing

Published: 1998

Total Pages: 0

ISBN-13: 9780070371354

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Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Electrical and Electronic Devices, Circuits, and Materials
Electrical and Electronic Devices, Circuits, and Materials

Author: Suman Lata Tripathi

Publisher: John Wiley & Sons

Published: 2021-03-24

Total Pages: 608

ISBN-13: 1119755085

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The increasing demand for electronic devices for private and industrial purposes lead designers and researchers to explore new electronic devices and circuits that can perform several tasks efficiently with low IC area and low power consumption. In addition, the increasing demand for portable devices intensifies the call from industry to design sensor elements, an efficient storage cell, and large capacity memory elements. Several industry-related issues have also forced a redesign of basic electronic components for certain specific applications. The researchers, designers, and students working in the area of electronic devices, circuits, and materials sometimesneed standard examples with certain specifications. This breakthrough work presents this knowledge of standard electronic device and circuit design analysis, including advanced technologies and materials. This outstanding new volume presents the basic concepts and fundamentals behind devices, circuits, and systems. It is a valuable reference for the veteran engineer and a learning tool for the student, the practicing engineer, or an engineer from another field crossing over into electrical engineering. It is a must-have for any library.

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring
High Temperature Electronics Design for Aero Engine Controls and Health Monitoring

Author: Stoica Lucian

Publisher: River Publishers

Published: 2016-09-30

Total Pages: 162

ISBN-13: 8793379250

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There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include: High temperature electronics marketHigh temperature devices, materials and assembly processesDesign, manufacture and testing of multi-sensor data acquisition system for aero-engine controlFuture applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.

Reliability and Failure of Electronic Materials and Devices
Reliability and Failure of Electronic Materials and Devices

Author: Milton Ohring

Publisher: Academic Press

Published: 2014-10-14

Total Pages: 759

ISBN-13: 0080575528

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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging

Author: Xingcun Colin Tong

Publisher: Springer Science & Business Media

Published: 2011-01-05

Total Pages: 633

ISBN-13: 1441977597

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Materials and Design
Materials and Design

Author: Michael F. Ashby

Publisher: Elsevier

Published: 2009-10-28

Total Pages: 342

ISBN-13: 0080949401

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Materials and Design: The Art and Science of Material Selection in Product Design, Second Edition, discusses the role of materials and processes in product design. The book focuses on the materials that designers need, as well as on how and why they use them. The book's 10 chapters cover topics such as function and personality, factors influencing product design, the design process, materials selection, and case studies in materials and design. Appendices for each chapter provide exercises for readers, along with detailed charts of technical attributes of different materials for reference. This book will be particularly useful to both students and working designers. Students are introduced to the role of materials in manufacturing and design, with the help of familiar language and concepts. Working designers can use the book as a reference source for materials and manufacturing. - The best guide ever published on the on the role of materials, past and present, in product development, by noted materials authority Mike Ashby and professional designer Kara Johnson--now with even better photos and drawings on the Design Process - Significant new section on the use of re-cycled materials in products, and the importance of sustainable design for manufactured goods and services - Enhanced materials profiles, with addition of new materials types like nanomaterials, advanced plastics and bio-based materials

Materials Enabled Designs
Materials Enabled Designs

Author: Michael Pfeifer

Publisher: Butterworth-Heinemann

Published: 2009-06-02

Total Pages: 321

ISBN-13: 0080941834

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There are books aplenty on materials selection criteria for engineering design. Most cover the physical and mechanical properties of specific materials, but few offer much in the way of total product design criteria. This innovative new text/reference will give the "Big picture view of how materials should be selected—not only for a desired function but also for their ultimate performance, durability, maintenance, replacement costs, and so on. Even such factors as how a material behaves when packaged, shipped, and stored will be taken into consideration. For without that knowledge, a design engineer is often in the dark as to how a particular material used in particular product or process is going to behave over time, how costly it will be, and, ultimately, how successful it will be at doing what is supposed to do. This book delivers that knowledge.* Brief but comprehensive review of major materials functional groups (mechanical, electrical, thermal, chemical) by major material categories (metals, polymers, ceramics, composites)* Invaluable guidance on selection criteria at early design stage, including such factors as functionality, durability, and availability* Insight into lifecycle factors that affect choice of materials beyond simple performance specs, including manufacturability, machinability, shelf life, packaging, and even shipping characteristics* Unique help on writing materials selection specifications