Electronic Packaging Materials Science VIII: Volume 390
Electronic Packaging Materials Science VIII: Volume 390

Author: Robert C. Sundahl

Publisher:

Published: 1995-09-26

Total Pages: 312

ISBN-13:

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The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.

Electronic Packaging Materials Science IX: Volume 445
Electronic Packaging Materials Science IX: Volume 445

Author: Steven K. Groothuis

Publisher:

Published: 1997-10-20

Total Pages: 344

ISBN-13:

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While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Diagnostic Techniques for Semiconductor Materials Processing: Volume 406
Diagnostic Techniques for Semiconductor Materials Processing: Volume 406

Author: Stella W. Pang

Publisher:

Published: 1996-03-18

Total Pages: 616

ISBN-13:

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The fabrication of Si- and compound semiconductor-based devices involves a number of steps ranging from material growth to pattern definition by lithography, and ultimately, pattern transfer by etching/deposition. The key to device manufacturing, however, is reproducibility, low cost and high yield. Diagnostic techniques allow correlation between processing and actual device performance to be established. Researchers from universities, industry and government come together in this book to examine the advances in diagnostic techniques that provide critical information on structural, optical and electrical properties of semiconductor devices, as well as monitoring techniques for equipment/processes for control and feedback. The overriding goal is for rapid, accurate materials characterization, both in situ and ex situ. Topics include: in situ diagnostics; proximal probe microscopies; optical probes of devices and device properties; spectroscopic ellipsometry/structural diagnostics; and material analysis - X-ray techniques, strain measurements and passivation.

Ion-Solid Interactions for Materials Modification and Processing: Volume 396
Ion-Solid Interactions for Materials Modification and Processing: Volume 396

Author: D. B. Poker

Publisher:

Published: 1996-05-23

Total Pages: 940

ISBN-13:

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Several beam-solid interaction techniques have been developed that can either stand alone or be used in connection with others for materials processing, for fabrication of devices with enhanced electro-optical and mechanical properties, and with enhanced resistance to corrosion and erosion. For example, advances in focused ion beams (FIB) have brought out-of-reach ideas and applications to fruition. This book from MRS focuses on the developments in ion-beam-assisted processing of materials and reviews successful applications of the techniques. Topics include: fundamentals of ion-solid interactions; ion-beam mixing; radiation damage; insulators and wide bandgap materials; polymers; optical materials; plasma and ion-assisted techniques; metals and tribology; focused ion beams; fundamental semiconductor processing and compound semiconductors.

Covalent Ceramics III: Volume 410
Covalent Ceramics III: Volume 410

Author: Aloysius F. Hepp

Publisher:

Published: 1996-08-14

Total Pages: 512

ISBN-13:

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In years prior, there has been considerable research activity in an exciting class of materials - non-oxide covalent ceramics. These nitrides, carbides, sulfides and related materials have found a wide range of use, from electronics to aerospace/defense, optical sensors and devices, and mechanical/structural applications. In this book, the third in a continuing series, chemists, physicists, ceramists and materials scientists and engineers from around the world come together to share research and highlight recent advances in non-oxide materials. In contrast to its predecessors, the focus of the volume is less on production and fabrication, and more on applications and properties. Topics include: non-oxides for electronics and optoelectronics; preparation of bulk non-oxide ceramics; science of covalent ceramics - bonding, structure and microstructure; fabrication of covalent ceramic thin films; and technology of covalent ceramics - surfaces, composites and processing.