Electronic Packaging Materials Science IX: Volume 445
Electronic Packaging Materials Science IX: Volume 445

Author: Steven K. Groothuis

Publisher:

Published: 1997-10-20

Total Pages: 344

ISBN-13:

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While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Applied Materials Science
Applied Materials Science

Author: Deborah D. L. Chung

Publisher: CRC Press

Published: 2001-06-13

Total Pages: 253

ISBN-13: 1420040979

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Materials are the foundation of technology. As such, most universities provide engineering undergraduates with the fundamental concepts of materials science, including crystal structures, imperfections, phase diagrams, materials processing, and materials properties. Few, however, offer the practical, applications-oriented background that their stud

Materials for Mechanical and Optical Microsystems: Volume 444
Materials for Mechanical and Optical Microsystems: Volume 444

Author: Michael L. Reed

Publisher:

Published: 1997-03-30

Total Pages: 264

ISBN-13:

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A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR

Specimen Preparation for Transmission Electron Microscopy of Materials IV
Specimen Preparation for Transmission Electron Microscopy of Materials IV

Author: Ron M. Anderson

Publisher:

Published: 1997

Total Pages: 320

ISBN-13:

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Successful transmission electron microscopy (TEM) experimentation depends on many things, one being specimen preparation. Whereas TEM samples of bulk metallic or ceramic materials can be prepared in a straightforward manner, the need to examine nonbulk and/or other classes of materials creates a need for more specialized preparation methods. This book from MRS, the fourth in a successful series, pioneers novel methods or ways of characterizing the specimen preparation process. Contributions to the book are tutorial in nature, and therefore somewhat longer than usual. Papers cover both general and materials-specific specimen preparation methods. Metallic, polymer, plastic, semiconducting, ceramic and magnetic materials as found in bulk, thin-film, dispersed and powdered forms are discussed.

Defects in Electronic Materials II: Volume 442
Defects in Electronic Materials II: Volume 442

Author: Jürgen Michel

Publisher:

Published: 1997-05-02

Total Pages: 744

ISBN-13:

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The pervasive role of defects in determining the thermal, mechanical, electrical, optical and magnetic properties of materials is significant as is the knowledge and operation of generation and control of defects in electronic materials. Developing novel semiconductor materials, however, requires new insights into the role of defects to achieve new properties. New experimental techniques must be developed to study defects in small structures. Research groups come together in this book from MRS to provide a vivid picture of the current problems, progress and methods in defect studies in electronic materials. Topics include new techniques in defect studies; processing induced defects, plasma-induced point defects; processing induced defects -defects and gate-oxide integrity; point defects and reaction; point defects and interactions in Si; impurity diffusion and hydrogen in Si; dislocations in group IV semiconductors; point defects and defect interactions in SiGe; point defects in III-V compounds; compensation and structural defects in III-V compounds and layers and structures.

Interfacial Engineering for Optimized Properties: Volume 458
Interfacial Engineering for Optimized Properties: Volume 458

Author: Clyde L. Briant

Publisher:

Published: 1997-07-08

Total Pages: 546

ISBN-13:

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The study of interfaces is one of the oldest areas of research in materials science. The presence of grain boundaries in materials has long been recognized, as has its crucial role in determining mechanical properties. Another long-recognized concept is that the properties of a surface are quite different from those of the bulk. In recent years, researchers have been able to study these interfaces, both internal and external, with a detail not before possible. These advances have stemmed from the ability to obtain atomic resolution images of interfaces, to measure accurate chemical compositions of interfaces, and to model these interfaces and their properties. This volume goes a step further, beyond structural and chemical studies, to explore how all of this information can be used to engineer interfaces for improved properties and overall improved material performance. Significant attention is given to the crystallographic nature of grain boundaries and interfaces, and the relationship between this nature and the performance of a material. The versatility of electron back-scattering pattern analysis (EBSP) in solving a number of interface-related problems is also featured.