Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties

Author: Michael Pecht

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 126

ISBN-13: 135183004X

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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties

Author: Michael Pecht

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 120

ISBN-13: 1498730868

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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging

Author: Xingcun Colin Tong

Publisher: Springer Science & Business Media

Published: 2011-01-05

Total Pages: 633

ISBN-13: 1441977597

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Introduction to the Electronic Properties of Materials
Introduction to the Electronic Properties of Materials

Author: David C. Jiles

Publisher: CRC Press

Published: 2017-12-21

Total Pages: 452

ISBN-13: 135198988X

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Electronic materials provide the basis for many high tech industries that have changed rapidly in recent years. In this fully revised and updated second edition, the author discusses the range of available materials and their technological applications. Introduction to the Electronic Properties of Materials, 2nd Edition presents the principles of the behavior of electrons in materials and develops a basic understanding with minimal technical detail. Broadly based, it touches on all of the key issues in the field and offers a multidisciplinary approach spanning physics, electrical engineering, and materials science. It provides an understanding of the behavior of electrons within materials, how electrons determine the magnetic thermal, optical and electrical properties of materials, and how electronic properties are controlled for use in technological applications. Although some mathematics is essential in this area, the mathematics that is used is easy to follow and kept to an appropriate level for the reader. An excellent introductory text for undergraduate students, this book is a broad introduction to the topic and provides a careful balance of information that will be appropriate for physicists, materials scientists, and electrical engineers.

Semiconductor Packaging
Semiconductor Packaging

Author: Andrea Chen

Publisher: CRC Press

Published: 2016-04-19

Total Pages: 208

ISBN-13: 1439862079

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Power Electronic Packaging
Power Electronic Packaging

Author: Yong Liu

Publisher: Springer Science & Business Media

Published: 2012-02-15

Total Pages: 606

ISBN-13: 1461410533

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Electronic Packaging Science and Technology
Electronic Packaging Science and Technology

Author: King-Ning Tu

Publisher: John Wiley & Sons

Published: 2021-12-29

Total Pages: 340

ISBN-13: 1119418313

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Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

The Electronic Packaging Handbook
The Electronic Packaging Handbook

Author: Glenn R. Blackwell

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 648

ISBN-13: 9781420049848

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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Electronic Composites
Electronic Composites

Author: Minoru Taya

Publisher: Cambridge University Press

Published: 2008-04-24

Total Pages: 258

ISBN-13: 9780521057318

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This 2005 book describes the processing, simulation and applications of electronic composites.

Biopolymer Composites in Electronics
Biopolymer Composites in Electronics

Author: Kishor Kumar Sadasivuni

Publisher: Elsevier

Published: 2016-09-10

Total Pages: 546

ISBN-13: 0081009747

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Biopolymer Composites in Electronics examines the current state-of-the-art in the electronic application based on biopolymer composites. Covering the synthesis, dispersion of fillers, characterization and fabrication of the composite materials, the book will help materials scientists and engineers address the challenges posed by the increased use of biopolymeric materials in electronic applications. The influence of preparation techniques on the generation of micro, meso, and nanoscale fillers, and the effect of filler size and dispersion on various biopolymers are discussed in detail. Applications covered include sensors, actuators, optics, fuel cells, photovoltaics, dielectrics, electromagnetic shielding, piezoelectrics, flexible displays, and microwave absorbers. In addition, characterization techniques are discussed and compared, enabling scientists and engineers to make the correct choice of technique. This book is a 'one-stop' reference for researchers, covering the entire state-of-the-art in biopolymer electronics. Written by a collection of expert worldwide contributors from industry, academia, government, and private research institutions, it is an outstanding reference for researchers in the field of biopolymer composites for advanced technologies. - Enables researchers to keep up with the rapid development of biopolymer electronics, which offer light, flexible, and more cost-effective alternatives to conventional materials of solar cells, light-emitting diodes, and transistors - Includes thorough coverage of the physics and chemistry behind biopolymer composites, helping readers to become rapidly acquainted with the fiel - Provides in-depth information on the range of biopolymer applications in electronics, from printed flexible conductors and novel semiconductor components, to intelligent labels, large area displays, and solar panels