Electronic Circuits, Discrete and Integrated
Author: Donald L. Schilling
Publisher:
Published: 1968
Total Pages: 720
ISBN-13:
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Author: Donald L. Schilling
Publisher:
Published: 1968
Total Pages: 720
ISBN-13:
DOWNLOAD EBOOKAuthor: Denton J. Dailey
Publisher:
Published: 2001
Total Pages: 842
ISBN-13:
DOWNLOAD EBOOKThis new text by Denton J. Dailey covers both discrete and integrated components. Among the many features that students will find helpful in understanding the material are the following: Concept icons in the margins signify that topical coverage relates to other fields and areas of electronics, such as communications, microprocessors, and digital electronics. These icons help the reader to answer the question, "Why is it important for me to learn this?" Key terms presented in each chapter are defined in the margins to reinforce students' understanding. Chapter objectives introduce each chapter and provide students with a roadmap of topics to be covered.
Author: Mohammed Shuaib Ghausi
Publisher:
Published: 1985
Total Pages: 808
ISBN-13: 9784833702737
DOWNLOAD EBOOKAuthor: Donald L. Schilling
Publisher: McGraw-Hill Companies
Published: 1989
Total Pages: 968
ISBN-13:
DOWNLOAD EBOOKAuthor: Donald L. Schilling
Publisher:
Published: 1981
Total Pages: 811
ISBN-13:
DOWNLOAD EBOOKAuthor: Rohit Sharma
Publisher: CRC Press
Published: 2018-09-03
Total Pages: 328
ISBN-13: 1351831593
DOWNLOAD EBOOKThree-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Author: Schilling
Publisher: Tata McGraw-Hill Education
Published: 2002-10
Total Pages: 0
ISBN-13: 9780070528987
DOWNLOAD EBOOKAuthor: Donald L. Schilling
Publisher:
Published: 1981
Total Pages: 811
ISBN-13: 9780070665514
DOWNLOAD EBOOKAuthor: Edward Karalis
Publisher: Dearborn Trade Publishing
Published: 2004
Total Pages: 428
ISBN-13: 9780793185115
DOWNLOAD EBOOKThis collection of solved electrical engineering problems should help you review for the Fundamentals of Engineering (FE) and Principles and Practice (PE) exams. With this guide, you'll hone your skills as well as your understanding of both fundamental and more difficult topics. 100% problems and step-by-step solutions.
Author: Ervine M. Rips
Publisher: Prentice Hall
Published: 1986
Total Pages: 440
ISBN-13:
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