Piezoelectric Energy Harvesting
Piezoelectric Energy Harvesting

Author: Alper Erturk

Publisher: John Wiley & Sons

Published: 2011-04-04

Total Pages: 377

ISBN-13: 1119991358

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The transformation of vibrations into electric energy through the use of piezoelectric devices is an exciting and rapidly developing area of research with a widening range of applications constantly materialising. With Piezoelectric Energy Harvesting, world-leading researchers provide a timely and comprehensive coverage of the electromechanical modelling and applications of piezoelectric energy harvesters. They present principal modelling approaches, synthesizing fundamental material related to mechanical, aerospace, civil, electrical and materials engineering disciplines for vibration-based energy harvesting using piezoelectric transduction. Piezoelectric Energy Harvesting provides the first comprehensive treatment of distributed-parameter electromechanical modelling for piezoelectric energy harvesting with extensive case studies including experimental validations, and is the first book to address modelling of various forms of excitation in piezoelectric energy harvesting, ranging from airflow excitation to moving loads, thus ensuring its relevance to engineers in fields as disparate as aerospace engineering and civil engineering. Coverage includes: Analytical and approximate analytical distributed-parameter electromechanical models with illustrative theoretical case studies as well as extensive experimental validations Several problems of piezoelectric energy harvesting ranging from simple harmonic excitation to random vibrations Details of introducing and modelling piezoelectric coupling for various problems Modelling and exploiting nonlinear dynamics for performance enhancement, supported with experimental verifications Applications ranging from moving load excitation of slender bridges to airflow excitation of aeroelastic sections A review of standard nonlinear energy harvesting circuits with modelling aspects.

Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
Adaptive Cooling of Integrated Circuits Using Digital Microfluidics

Author: Philip Y. Paik

Publisher: Artech House Publishers

Published: 2007

Total Pages: 216

ISBN-13:

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Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.

Advanced Thermoelectric Materials for Energy Harvesting Applications
Advanced Thermoelectric Materials for Energy Harvesting Applications

Author: Saim Memon

Publisher: BoD – Books on Demand

Published: 2019-10-30

Total Pages: 142

ISBN-13: 1789845289

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Advanced Thermoelectric Materials for Energy Harvesting Applications is a research-intensive textbook covering the fundamentals of thermoelectricity and the process of converting heat energy into electrical energy. It covers the design, implementation, and performance of existing and advanced thermoelectric materials. Chapters examine such topics as organic/inorganic thermoelectric materials, performance and behaviors of thermoelectric devices, and energy harvesting applications of thermoelectric devices.

Heat Transfer
Heat Transfer

Author: Younes Shabany

Publisher: CRC Press

Published: 2009-12-17

Total Pages: 526

ISBN-13: 1439814686

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The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use

Advanced Flip Chip Packaging
Advanced Flip Chip Packaging

Author: Ho-Ming Tong

Publisher: Springer Science & Business Media

Published: 2013-03-20

Total Pages: 562

ISBN-13: 1441957685

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Electronics Cooling
Electronics Cooling

Author: S. M. Sohel Murshed

Publisher: BoD – Books on Demand

Published: 2016-06-15

Total Pages: 184

ISBN-13: 9535124056

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Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.

Thermal Management of Electronic Systems II
Thermal Management of Electronic Systems II

Author: E. Beyne

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 358

ISBN-13: 9401155062

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For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

Solar Heating and Cooling Systems
Solar Heating and Cooling Systems

Author: Ioan Sarbu

Publisher: Academic Press

Published: 2016-10-18

Total Pages: 442

ISBN-13: 0128116633

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Solar Heating and Cooling Systems: Fundamentals, Experiments and Applications provides comprehensive coverage of this modern energy issue from both a scientific and technical level that is based on original research and the synthesis of consistent bibliographic material that meets the increasing need for modernization and greater energy efficiency to significantly reduce CO2 emissions. Ioan Sarbu and Calin Sebarchievici present a comprehensive overview of all major solar energy technologies, along with the fundamentals, experiments, and applications of solar heating and cooling systems. Technical, economic, and energy saving aspects related to design, modeling, and operation of these systems are also explored. This reference includes physical and mathematical concepts developed to make this publication a self-contained and up-to-date source of information for engineers, researchers, and professionals who are interested in the use of solar energy as an alternative energy source. - Includes learning aims, chapter summaries, problems and solutions to support the theories presented - Puts a specific emphasis on the practical application of the technologies in heating and cooling systems - Contains calculating equations for the energy and economic index of solar systems

Heat Transfer in Polymer Composite Materials
Heat Transfer in Polymer Composite Materials

Author: Nicolas Boyard

Publisher: John Wiley & Sons

Published: 2016-03-28

Total Pages: 464

ISBN-13: 1848217617

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This book addresses general information, good practices and examples about thermo-physical properties, thermo-kinetic and thermo-mechanical couplings, instrumentation in thermal science, thermal optimization and infrared radiation.

Fundamentals of Semiconductor Manufacturing and Process Control
Fundamentals of Semiconductor Manufacturing and Process Control

Author: Gary S. May

Publisher: John Wiley & Sons

Published: 2006-05-26

Total Pages: 428

ISBN-13: 0471790273

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A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.