This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Handbook of Approximation Algorithms and Metaheuristics, Second Edition reflects the tremendous growth in the field, over the past two decades. Through contributions from leading experts, this handbook provides a comprehensive introduction to the underlying theory and methodologies, as well as the various applications of approximation algorithms and metaheuristics. Volume 1 of this two-volume set deals primarily with methodologies and traditional applications. It includes restriction, relaxation, local ratio, approximation schemes, randomization, tabu search, evolutionary computation, local search, neural networks, and other metaheuristics. It also explores multi-objective optimization, reoptimization, sensitivity analysis, and stability. Traditional applications covered include: bin packing, multi-dimensional packing, Steiner trees, traveling salesperson, scheduling, and related problems. Volume 2 focuses on the contemporary and emerging applications of methodologies to problems in combinatorial optimization, computational geometry and graphs problems, as well as in large-scale and emerging application areas. It includes approximation algorithms and heuristics for clustering, networks (sensor and wireless), communication, bioinformatics search, streams, virtual communities, and more. About the Editor Teofilo F. Gonzalez is a professor emeritus of computer science at the University of California, Santa Barbara. He completed his Ph.D. in 1975 from the University of Minnesota. He taught at the University of Oklahoma, the Pennsylvania State University, and the University of Texas at Dallas, before joining the UCSB computer science faculty in 1984. He spent sabbatical leaves at the Monterrey Institute of Technology and Higher Education and Utrecht University. He is known for his highly cited pioneering research in the hardness of approximation; for his sublinear and best possible approximation algorithm for k-tMM clustering; for introducing the open-shop scheduling problem as well as algorithms for its solution that have found applications in numerous research areas; as well as for his research on problems in the areas of job scheduling, graph algorithms, computational geometry, message communication, wire routing, etc.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
For a decade, with the uptake of 4G, we have become accustomed to the relentless increase in data and services on the move. The deployment of 5G is advancing crucial key performance indicators (KPIs), along with quality of service (QoS). Setting the horizon to 2030 and later, 6G will take the KPIs to numbers 100–1000 times better than 5G. Yet, the actual disruption of 6G and future networks (FN) will take place following other unprecedented paths. Artificial intelligence (AI) will be exploited in a threadlike fashion, at any level of the network physical infrastructure. This will introduce, to date unknown features, like self-sustaining, self-evolution and high-resilience of small portions of the infrastructure, pioneering the concept of a network of networks. Each segment of the infrastructure will bear a high degree of independence, while working at the same time as a whole, in full orchestration with the rest of the network. Given such a scenario, this book claims that the established and currently in use paradigms for the design and development of hardware–software (HW–SW) systems, are not appropriate to address the challenges of 6G and, further ahead, of FN. In response, unprecedented design approaches are suggested, relying on a fresh reinterpretation of the standard concept of HW, with specific attention to the network edge and edge intelligence (EI). This work develops some conceptual tools that may help address the technical challenges resulting from the intricate scenario sketched above. Within the mentioned HW reconceptualization, a pivotal role is forecasted for microtechnologies and nanotechnologies, intended with a broad meaning, which embraces, among others, devices, systems (MEMS/NEMS) and materials.
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Integrating aspects of engineering, application physics, and medical science, Solid-State Radiation Detectors: Technology and Applications offers a comprehensive review of new and emerging solid-state materials-based technologies for radiation detection. Each chapter is structured to address the current advantages and challenges of each material and technology presented, as well as to discuss novel research and applications. Featuring contributions from leading experts in industry and academia, this authoritative text: Covers modern semiconductors used for radiation monitoring Examines CdZnTe and CdTe technology for imaging applications including three-dimensional capability detectors Highlights interconnect technology for current pixel detectors Describes hybrid pixel detectors and their characterizations Tackles the integrated analog signal processing read-out front ends for particle detectors Considers new organic materials with direct bandgap for direct energy detection Summarizes recent developments involving lanthanum halide and cerium bromide scintillators Analyzes the potential of recent progress in the field of crystallogenesis, quantum dots, and photonics crystals toward a new concept of x- and gamma-ray detectors based on metamaterials Explores position-sensitivity photomultipliers and silicon photomultipliers for scintillation crystals Solid-State Radiation Detectors: Technology and Applications provides a valuable reference for engineers and scientists looking to enhance the performance of radiation detector technology for medical imaging and other applications.
Analog Electronics for Radiation Detection showcases the latest advances in readout electronics for particle, or radiation, detectors. Featuring chapters written by international experts in their respective fields, this authoritative text: Defines the main design parameters of front-end circuitry developed in microelectronics technologies Explains the basis for the use of complementary metal–oxide semiconductor (CMOS) image sensors for the detection of charged particles and other non-consumer applications Delivers an in-depth review of analog-to-digital converters (ADCs), evaluating the pros and cons of ADCs integrated at the pixel, column, and per-chip levels Describes incremental sigma–delta ADCs, time-to-digital converter (TDC) architectures, and digital pulse-processing techniques complementary to analog processing Examines the fundamental parameters and front-end types associated with silicon photomultipliers used for single visible-light photon detection Discusses pixel sensors with per-pixel TDCs, channel density challenges, and emerging 3D technologies interconnecting detectors and electronics Thus, Analog Electronics for Radiation Detection provides a single source for state-of-the-art information on analog electronics for the readout of radiation detectors.
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
