Design and Packaging of Electronic Equipment
Author: Joel L. Sloan
Publisher:
Published: 1985
Total Pages: 602
ISBN-13:
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Electronic Equipment Packaging Technology
Author: Gerald L. Ginsberg
Publisher: Springer Science & Business Media
Published: 2013-11-27
Total Pages: 285
ISBN-13: 1461535425
DOWNLOAD EBOOKThe last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Thermal Design of Electronic Equipment
Author: Ralph Remsburg
Publisher: CRC Press
Published: 2017-12-19
Total Pages: 440
ISBN-13: 1351835912
DOWNLOAD EBOOKIn a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Author: Hengyun Zhang
Publisher: Woodhead Publishing
Published: 2019-11-14
Total Pages: 436
ISBN-13: 0081025335
DOWNLOAD EBOOKModeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Advanced Thermal Design of Electronic Equipment
Author: Ralph Remsburg
Publisher: Springer Science & Business Media
Published: 1998-02-28
Total Pages: 632
ISBN-13: 9780412122712
DOWNLOAD EBOOKWith today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Handbook of Electronic Package Design
Author: Michael Pecht
Publisher: CRC Press
Published: 2018-10-24
Total Pages: 904
ISBN-13: 1351838415
DOWNLOAD EBOOKBoth a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Practical Guide to the Packaging of Electronics
Author: Ali Jamnia
Publisher: CRC Press
Published: 2002-10-08
Total Pages: 200
ISBN-13: 1482275848
DOWNLOAD EBOOKWhether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.
The Electronic Packaging Handbook
Author: Glenn R. Blackwell
Publisher: CRC Press
Published: 2017-12-19
Total Pages: 648
ISBN-13: 9781420049848
DOWNLOAD EBOOKThe packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Power Electronic Packaging
Author: Yong Liu
Publisher: Springer Science & Business Media
Published: 2012-02-15
Total Pages: 606
ISBN-13: 1461410533
DOWNLOAD EBOOKPower Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Designing Electronic Product Enclosures
Author: Tony Serksnis
Publisher: Springer
Published: 2018-07-25
Total Pages: 226
ISBN-13: 3319693956
DOWNLOAD EBOOKThis book explains the design and fabrication of any electronic enclosure that contains a printed circuit board, from original design through materials selection, building and testing, and ongoing design improvement. It presents a thorough and lucid treatment of material physical properties, engineering, and compliance considerations such that readers will understand concerns that exist with a design (structural, environmental, and regulatory) and what is needed to successfully enter the marketplace. To this end, a main thrust of this volume is on the “commercialization” of electronic products when an enclosure is needed. The book targets the broadest audience tasked with design and manufacture of an enclosure for an electronic product, from mechanical/industrial engineers to designers and technicians. Compiling a wealth of information on relevant physical phenomena (strength of materials, shock and vibration, heat transfer), the book stands as a ready reference on how and where these key properties may be considered in the design of most electronic enclosures.
