Illustrates the use of several modeling and simulation techniques for optoelectronic circuit and system design analysis, intended to address the general lack of advanced modeling and simulation infrastructure currently available. Topics range from a review of conventional electronic circuit simulati
In Optoelectronic Integrated Circuit Design and Device Modeling, Professor Jianjun Gao introduces the fundamentals and modeling techniques of optoelectronic devices used in high-speed optical transmission systems. Gao covers electronic circuit elements such as FET, HBT, MOSFET, as well as design techniques for advanced optical transmitter and receiver front-end circuits. The book includes an overview of optical communication systems and computer-aided optoelectronic IC design before going over the basic concept of laser diodes. This is followed by modeling and parameter extraction techniques of lasers and photodiodes. Gao covers high-speed electronic semiconductor devices, optical transmitter design, and optical receiver design in the final three chapters. Addresses a gap within the rapidly growing area of transmitter and receiver modeling in OEICs Explains diode physics before device modeling, helping readers understand their equivalent circuit models Provides comprehensive explanations for E/O and O/E conversions done with laser and photodiodes Covers an extensive range of devices for high-speed applications Accessible for students new to microwaves Presentation slides available for instructor use This book is primarily aimed at practicing engineers, researchers, and post-graduates in the areas of RF, microwaves, IC design, photonics and lasers, and solid state devices. The book is also a strong supplement for senior undergraduates taking courses in RF and microwaves. Lecture materials for instructors available at www.wiley.com/go/gao
Field-Programmable Analog Arrays brings together in one place important contributions and up-to-date research results in this fast moving area. Field-Programmable Analog Arrays serves as an excellent reference, providing insight into some of the most challenging research issues in the field.
Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis for understanding the underlying mechanisms of the OEICs described in the main part of the book. In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-μm CMOS. Numerous detailed illustrations help to elucidate the material.
Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries, with applications in a variety of areas, from consumer electronics to high performance information networks. The requiremets for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides and overview of this technology.
The demands of increasingly complex embedded systems and associated performance computations have resulted in the development of heterogeneous computing architectures that often integrate several types of processors, analog and digital electronic components, and mechanical and optical components—all on a single chip. As a result, now the most prominent challenge for the design automation community is to efficiently plan for such heterogeneity and to fully exploit its capabilities. A compilation of work from internationally renowned authors, Model-Based Design for Embedded Systems elaborates on related practices and addresses the main facets of heterogeneous model-based design for embedded systems, including the current state of the art, important challenges, and the latest trends. Focusing on computational models as the core design artifact, this book presents the cutting-edge results that have helped establish model-based design and continue to expand its parameters. The book is organized into three sections: Real-Time and Performance Analysis in Heterogeneous Embedded Systems, Design Tools and Methodology for Multiprocessor System-on-Chip, and Design Tools and Methodology for Multidomain Embedded Systems. The respective contributors share their considerable expertise on the automation of design refinement and how to relate properties throughout this refinement while enabling analytic and synthetic qualities. They focus on multi-core methodological issues, real-time analysis, and modeling and validation, taking into account how optical, electronic, and mechanical components often interface. Model-based design is emerging as a solution to bridge the gap between the availability of computational capabilities and our inability to make full use of them yet. This approach enables teams to start the design process using a high-level model that is gradually refined through abstraction levels to ultimately yield a prototype. When executed well, model-based design encourages enhanced performance and quicker time to market for a product. Illustrating a broad and diverse spectrum of applications such as in the automotive aerospace, health care, consumer electronics, this volume provides designers with practical, readily adaptable modeling solutions for their own practice.
This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
