Advances in Manufacturing Technology II
Advances in Manufacturing Technology II

Author: Peter F. McGoldrick

Publisher: Springer Science & Business Media

Published: 2013-11-21

Total Pages: 422

ISBN-13: 1461585244

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EN Corlett Joint-Chairman - COPED, University of Nottingham, Nottingham, UK The contributions offered to this Third National Conference demonstrate that research in production is very much alive. The considerable numbers of papers on robotics, automation and flexible manufacturing systems, together with those in production control and quality matters, demonstrate that there is much work going on in our colleges, polytechnics and universities related to modern methods of manufacture. The future of manufacture undoubtedly hinges on better control. Control over the supply and movement of materials is now keenly sought. Control over manufacturing equipment is also a goal, not just to maintain quality but to give flexibility in sequence and quantity. None of these objectives for improved performance is entirely a technical matter, although there is an increasing technical ability to influence all of them. To achieve their potential, they depend on competent people at all levels. Discussion with alert managers soon reveals that this is one of their major concerns. Either the people they have require more training, or they cannot hire the people with the abilities they need. This applies at all levels, and the availability of people with competence in manufacture is particularly low.

IC Component Sockets
IC Component Sockets

Author: Weifeng Liu

Publisher: John Wiley & Sons

Published: 2004-03-25

Total Pages: 242

ISBN-13: 9780471460503

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A broad and practical reference to IC socket technology The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment-with emphasis on the technology's inherent advantages and challenges. Topics of interest include: * Socket design and contact technologies * Performance characteristics and material properties * Contact failure modes and mechanisms * Qualification testing conditions * Qualification sequences and setup * IEEE prediction methodology * Theoretical calculation of contact reliability Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.

Modern Ferrites, Volume 2
Modern Ferrites, Volume 2

Author: Vincent G. Harris

Publisher: John Wiley & Sons

Published: 2022-11-14

Total Pages: 421

ISBN-13: 1394156138

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MODERN FERRITES, Volume 2 A robust exploration of the basic principles of ferrimagnetic and their applications In Modern Ferrites: Volume 2, renowned researcher and educator, Vincent G. Harris delivers a comprehensive overview of ferrimagnetic phenomena and discussions of select applications of modern ferrite materials in emerging technologies and applications. Volume 2 explores fundamental properties of ferrite systems, including their structure, chemistry, and magnetism, as well as practical applications, such as permanent magnets; inductors, inverters, and filters; and their use in emerging applications as metamaterials, multiferroics, and biomedical technologies. In addition to the properties of ferrites, the included resources explore the processing, structure, and property relationships in ferrites as nanoparticles, thin and thick films, compacts, and crystals. The authors discuss how these relationships are key to realizing practical device applications laying the foundation for next generation communications, radar, sensing, and biomedical technologies. This volume includes: A comprehensive review of ferrite discoveries and impacts upon ancient cultures, their scientific evolution, and societal benefits; Discussion of the origins of magnetism in ferrimagnetic oxides including superexchange theory, GKA-rules, and recent developments in density functional theory; In-depth examination of ferrite power conversion and conditioning components and their processing as low temperature co-fired ceramics; Ferrite-based electromagnetic interference suppression and electromagnetic absorption; Nonlinear microwave devices; multiferroic and emerging magnetoelectric devices; Biomedical applications of ferrite nanoparticles Perfect for RF engineers and magnetitians working in the fields of RF electronics, radar, communications, and spintronics as well as other emerging technologies. Modern Ferrites will earn a place on the bookshelves of engineers and scientists interested in the ever-expanding technologies reliant upon ferrite materials and new processing methodologies. Modern Ferrites Volume 1: Basic Principles, Processing and Properties is also available (ISBN: 9781118971468).

Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices

Author: X.J. Fan

Publisher: Springer Science & Business Media

Published: 2010-07-23

Total Pages: 573

ISBN-13: 1441957197

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Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Application Specific Integrated Circuits
Application Specific Integrated Circuits

Author: Edward Fisher

Publisher: BoD – Books on Demand

Published: 2019-04-17

Total Pages: 102

ISBN-13: 178985847X

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The field of application-specific integrated circuits (ASICs) is fast-paced being at the very forefront of modern nanoscale fabrication and presents a deeply engaging career path. ASICs can provide us with high-speed computation in the case of digital circuits. For example, central processing units, graphics processing units, field-programmable gate arrays, and custom-made digital signal processors are examples of ASICs and the transistors they are fabricated from. We can use that same technology complementary metal-oxide semiconductor processes to implement high-precision sensing of or interfacing to the world through analog-to-digital converters, digital-to-analog converters, custom image sensors, and highly integrated micron-scale sensors such as magnetometers, accelerometers, and microelectromechanical machines. ASIC technologies now transitioning toward magneto-resistive and phase-changing materials also offer digital memory capacities that have aided our technological progress. Combining these domains, we have moved toward big data analytics and the new era of artificial intelligence and machine learning. This book provides a small selection of chapters covering aspects of ASIC development and the surrounding business model.

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection

Author: Madhusudan Iyengar

Publisher: World Scientific

Published: 2024-01-10

Total Pages: 479

ISBN-13: 9811279381

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This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Surface Electromagnetics
Surface Electromagnetics

Author: Fan Yang

Publisher: Cambridge University Press

Published: 2019-06-20

Total Pages: 489

ISBN-13: 1108654207

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Written by the leading experts in the field, this text provides systematic coverage of the theory, physics, functional designs, and engineering applications of advanced engineered electromagnetic surfaces. All the essential topics are included, from the fundamental theorems of surface electromagnetics, to analytical models, general sheet transmission conditions (GSTC), metasurface synthesis, and quasi-periodic analysis. A plethora of examples throughout illustrate the practical applications of surface electromagnetics, including gap waveguides, modulated metasurface antennas, transmit arrays, microwave imaging, cloaking, and orbital angular momentum (OAM ) beam generation, allowing readers to develop their own surface electromagnetics-based devices and systems. Enabling a fully comprehensive understanding of surface electromagnetics, this is an invaluable text for researchers, practising engineers and students working in electromagnetics antennas, metasurfaces and optics.

Three-Dimensional Integrated Circuit Design
Three-Dimensional Integrated Circuit Design

Author: Vasilis F. Pavlidis

Publisher: Newnes

Published: 2017-07-04

Total Pages: 770

ISBN-13: 0124104843

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Electronics and Electrical Engineering
Electronics and Electrical Engineering

Author: Alan Zhao

Publisher: CRC Press

Published: 2015-07-28

Total Pages: 368

ISBN-13: 1315685329

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The 2014 Asia-Pacific Electronics and Electrical Engineering Conference (EEEC 2014) was held on December 27-28, 2014 in Shanghai, China. EEEC has provided a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Electroni