Dow Jones Private Equity Analyst
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Published: 2008
Total Pages: 458
ISBN-13:
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Semiconductor Packaging
Author: Andrea Chen
Publisher: CRC Press
Published: 2016-04-19
Total Pages: 208
ISBN-13: 1439862079
DOWNLOAD EBOOKIn semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Heterogeneous Integrations
Author: John H. Lau
Publisher: Springer
Published: 2019-04-03
Total Pages: 381
ISBN-13: 9811372241
DOWNLOAD EBOOKHeterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Materials for Advanced Packaging
Author: Daniel Lu
Publisher: Springer
Published: 2016-11-18
Total Pages: 974
ISBN-13: 3319450980
DOWNLOAD EBOOKSignificant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
China's Energy Revolution in the Context of the Global Energy Transition
Author: Shell International B.V.
Publisher: Springer Nature
Published: 2020-05-29
Total Pages: 734
ISBN-13: 3030401545
DOWNLOAD EBOOKThis open access book is an encyclopaedic analysis of the current and future energy system of the world’s most populous country and second biggest economy. What happens in China impacts the planet. In the past 40 years China has achieved one of the most remarkable economic growth rates in history. Its GDP has risen by a factor of 65, enabling 850,000 people to rise out of poverty. Growth on this scale comes with consequences. China is the world’s biggest consumer of primary energy and the world’s biggest emitter of CO2 emissions. Creating a prosperous and harmonious society that delivers economic growth and a high quality of life for all will require radical change in the energy sector, and a rewiring of the economy more widely. In China’s Energy Revolution in the Context of the Global Energy Transition, a team of researchers from the Development Research Center of the State Council of China and Shell International examine how China can revolutionise its supply and use of energy. They examine the entire energy system: coal, oil, gas, nuclear, renewables and new energies in production, conversion, distribution and consumption. They compare China with case studies and lessons learned in other countries. They ask which technology, policy and market mechanisms are required to support the change and they explore how international cooperation can smooth the way to an energy revolution in China and across the world. And, they create and compare scenarios on possible pathways to a future energy system that is low-carbon, affordable, secure and reliable.
Semiconductor Advanced Packaging
Author: John H. Lau
Publisher: Springer Nature
Published: 2021-05-17
Total Pages: 513
ISBN-13: 9811613761
DOWNLOAD EBOOKThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
The Power of Renewables
Author: Chinese Academy of Engineering
Publisher: National Academies Press
Published: 2011-01-29
Total Pages: 256
ISBN-13: 0309160006
DOWNLOAD EBOOKThe United States and China are the world's top two energy consumers and, as of 2010, the two largest economies. Consequently, they have a decisive role to play in the world's clean energy future. Both countries are also motivated by related goals, namely diversified energy portfolios, job creation, energy security, and pollution reduction, making renewable energy development an important strategy with wide-ranging implications. Given the size of their energy markets, any substantial progress the two countries make in advancing use of renewable energy will provide global benefits, in terms of enhanced technological understanding, reduced costs through expanded deployment, and reduced greenhouse gas (GHG) emissions relative to conventional generation from fossil fuels. Within this context, the U.S. National Academies, in collaboration with the Chinese Academy of Sciences (CAS) and Chinese Academy of Engineering (CAE), reviewed renewable energy development and deployment in the two countries, to highlight prospects for collaboration across the research to deployment chain and to suggest strategies which would promote more rapid and economical attainment of renewable energy goals. Main findings and concerning renewable resource assessments, technology development, environmental impacts, market infrastructure, among others, are presented. Specific recommendations have been limited to those judged to be most likely to accelerate the pace of deployment, increase cost-competitiveness, or shape the future market for renewable energy. The recommendations presented here are also pragmatic and achievable.
Introduction to Statistical Quality Control
Author: Douglas C. Montgomery
Publisher: John Wiley & Sons
Published:
Total Pages: 772
ISBN-13: 1119657075
DOWNLOAD EBOOK"This book is about the use of modern statistical methods for quality control and improvement. It provides comprehensive coverage of the subject from basic principles to state-of-the-art concepts. and applications. The objective is to give the reader a sound understanding of the principles and the basis for applying them in a variety of situations. Although statistical techniques are emphasized. throughout, the book has a strong engineering and management orientation. Extensive knowledge. of statistics is not a prerequisite for using this book. Readers whose background includes a basic course in statistical methods will find much of the material in this book easily accessible"--
Renewable Energy Sources and Climate Change Mitigation
Author: Ottmar Edenhofer
Publisher: Cambridge University Press
Published: 2011-11-21
Total Pages: 1088
ISBN-13: 9781107607101
DOWNLOAD EBOOKThis Intergovernmental Panel on Climate Change Special Report (IPCC-SRREN) assesses the potential role of renewable energy in the mitigation of climate change. It covers the six most important renewable energy sources - bioenergy, solar, geothermal, hydropower, ocean and wind energy - as well as their integration into present and future energy systems. It considers the environmental and social consequences associated with the deployment of these technologies, and presents strategies to overcome technical as well as non-technical obstacles to their application and diffusion. SRREN brings a broad spectrum of technology-specific experts together with scientists studying energy systems as a whole. Prepared following strict IPCC procedures, it presents an impartial assessment of the current state of knowledge: it is policy relevant but not policy prescriptive. SRREN is an invaluable assessment of the potential role of renewable energy for the mitigation of climate change for policymakers, the private sector, and academic researchers.
Fan-Out Wafer-Level Packaging
Author: John H. Lau
Publisher: Springer
Published: 2018-04-05
Total Pages: 319
ISBN-13: 9811088845
DOWNLOAD EBOOKThis comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
