SiC Power Module Design

SiC Power Module Design

Author: Alberto Castellazzi

Publisher: IET

Published: 2021-12-09

Total Pages: 359

ISBN-13: 1785619071

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Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.


Power Electronics and Power Quality

Power Electronics and Power Quality

Author: José Gabriel Oliveira Pinto

Publisher: MDPI

Published: 2020-04-23

Total Pages: 336

ISBN-13: 3039283588

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Power quality (PQ) is receiving more and more attention from consumers, distribution system operators, transmission system operators, and other entities related to electrical power systems. As PQ problems have direct implications for business productivity, causing high economic losses, the research and development monitoring technologies and power electronics solutions that ensure the PQ of the power systems are matters of utmost importance. This book is a collection of high quality papers published in the “Power Electronics and Power Quality” Special Issue of the journal Energies. It reflects on the latest investigations and the new trends in this field.


Conference Proceedings of 2022 2nd International Joint Conference on Energy, Electrical and Power Engineering

Conference Proceedings of 2022 2nd International Joint Conference on Energy, Electrical and Power Engineering

Author: Cungang Hu

Publisher: Springer Nature

Published: 2023-08-02

Total Pages: 1326

ISBN-13: 9819943345

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This book will be a collection of the conference manuscripts presented at the 2022 2nd International Joint Conference on Energy, Electrical and Power Engineering covering new and renewable energy, electrical and power engineering. It is expected to report the latest technological developments in the fields developed by academic researchers and industrial practitioners. The application and dissemination of these technologies will benefit the research community, as new research directions are becoming increasingly interdisciplinary, requiring researchers from different research areas to come together and share ideas. It will also benefit the electrical engineering and energy industry, as we are now experiencing a new wave of industrial revolution, i.e. the electrification, intelligentisation and digitalisation of our transport, manufacturing processes and way of thinking.


Latest Advances in Electrothermal Models

Latest Advances in Electrothermal Models

Author: Krzysztof Górecki

Publisher: MDPI

Published: 2021-03-17

Total Pages: 140

ISBN-13: 303650334X

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This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.


Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging

Author: Katsuaki Suganuma

Publisher: Woodhead Publishing

Published: 2018-05-28

Total Pages: 242

ISBN-13: 0081020953

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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. - Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance - Provides the latest research on potential solutions, with an eye towards the end goal of system integration - Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates


Extreme Environment Electronics

Extreme Environment Electronics

Author: John D. Cressler

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 1044

ISBN-13: 1351832808

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Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.


Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems

Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems

Author: Alhussein Albarbar

Publisher: Springer

Published: 2017-07-19

Total Pages: 224

ISBN-13: 3319598287

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This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.


Thermal Reliability of Power Semiconductor Device in the Renewable Energy System

Thermal Reliability of Power Semiconductor Device in the Renewable Energy System

Author: Xiong Du

Publisher: Springer Nature

Published: 2022-07-08

Total Pages: 184

ISBN-13: 9811931321

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This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.