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Author: Pepin van Roojen
Publisher: Agile Rabbit Edition
Published: 2010
Total Pages: 432
ISBN-13: 9789057681431
DOWNLOAD EBOOKBASIC PACKAGING, the first volume of a new series of packaging books ¿ Structural Package Design ¿ , contains 300 designs, including all major international packaging standards. The CDs also included a demo version of packaging software which folds and tests two-dimensional templates in 3-D.
Author: Candace Ellicott
Publisher: Rockport Publishers
Published: 2010-06-01
Total Pages: 209
ISBN-13: 1610580672
DOWNLOAD EBOOKThis book outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. This book is a quick reference and primer on package design, and the principles that make design projects successful. Highly visual and appealing to beginning designers, students, and working designers as a resource. The content helps to establish the rules and guides designers in knowing when and where to bend them. Visual examples demonstrate each principle so readers can see the principle at work in applied design.
Author: United States
Publisher:
Published: 1966
Total Pages: 252
ISBN-13:
DOWNLOAD EBOOKAuthor: Roger C. Griffin
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 388
ISBN-13: 9401173826
DOWNLOAD EBOOKSince the first edition of "Principles of Packaging Development" was published, the packaging industry has undergone many profound changes. These have included the virtual elimination of cellophane and its replacement with oriented polypropylene as a carton overwrap, fluid milk in blow-molded HDPE bottles, PET beverage bottles, cookie bags and cartons lined with polyolefin coextrusions instead of waxed glassine, and bread in reclosable polyolefin and coextruded film bags. New phrases have also worked their way into the lexicon of the practic ing packaging technologist, such as "child resistance" and "tamper evident. " This most popular text on packaging demanded updating. How these phrases and ideas have affected the industry in the 1980s and how they will probably alter its course in the future are treated. New concepts of packaging system planning and forecasting tech niques are intruding into package management, and new chapters will introduce them to the reader. The years have added a certain degree of maturity to the packaging industry. Not only have the original authors broadened their per spectives and changed professional responsibilities, we have also in cluded a third co-author, Dr. Aaron L. Brody, whose experience in the industry, academic background, and erudite insights into the very na ture of packaging have added an unparalled degree of depth to this book. We would like to thank David L.
Author: Hermann J. Koch
Publisher: John Wiley & Sons
Published: 2022-01-24
Total Pages: 1237
ISBN-13: 1119623618
DOWNLOAD EBOOKGAS INSULATED SUBSTATIONS An essential reference guide to gas-insulated substations The second edition of Gas Insulated Substations (GIS) is an all-inclusive reference guide to gas insulated substations (GIS) and its advanced technologies. Updated to the latest technical developments and applications, the guide covers basic physics of gas insulated systems, SF6 insulating gas and its alternatives, safety aspects and factors to choose GIS. GIS technology, its modular structure, control and monitoring systems, testing, installation rules and guidelines for operation, specification, and maintenance. Detailed information on various types for GIS, with 14 reference project explanations and three extensive case studies give information for the best solutions of practical applications. Special solutions using mobile substations concepts, mixed technology switchgear (MTS) with air and gas insulated technology, underground substations, and the use of special GIS substation buildings e.g., shopping centers, parking lots, city parks, business complexes’ or subway stations are explained. Future developments of GIS technology are shown for the next steps in alternatives to SF6, low power instrument transformers, and digitalization of substations. A new chapter explains advanced technologies applied to GIS projects which cover the following; environmental issues for the substation permission process, insulation coordination studies for the network requirements including very fast transients, project scope development, risk-based asset management, health and safety impact, electromagnetic fields, SF6 decomposition byproducts and condition assessment. Disruptive development steps in gas insulated substations technologies are also covered in this second edition. Vacuum breaking and switching technology for rated voltages of up to 500 kV is explained in detail with its physical background. Principle function and possible implementation of low power instrument transformers (LPIT) are explained and examples of applications are given. The principles of digital twin for gas insulated substations (GIS) and gas insulated transmission lines (GIL) are explained in theory and project applications show the practical use and advantage. The wide and fast-growing technical field of offshore GIS applications for AC and DC is explained on many examples and gives information on special requirements when getting offshore. Theoretical requirements on DC gas insulated systems, methods of testing, prototype installation tests, modular design features, and advantages in applications are given. Finally, impact and advantages of digital substations using GIS are explained. Key features: Written by leading GIS experts involved in development and project applications Discusses practical and theoretical aspects Detailed material of GIS for new and experienced GIS users, and project planners Invaluable guide to practicing electrical, mechanical and civil engineers as well as third- and fourth-year electric power engineering students
Author: Beth Keser
Publisher: John Wiley & Sons
Published: 2019-02-12
Total Pages: 576
ISBN-13: 1119314135
DOWNLOAD EBOOKExamines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: W.M. Wadman
Publisher: Routledge
Published: 2016-07-01
Total Pages: 334
ISBN-13: 1315501449
DOWNLOAD EBOOKExamines consumer decision-making on products and services of variable quality at the level of retail markets. Addresses for the first time consumer-producer interaction at the level of the individual consumer; issues of quality, consumption experience, and willingness-to-pay, as exhibited by individual consumers; and how these issues affect the decision-making process.
Author:
Publisher:
Published: 1978
Total Pages: 54
ISBN-13:
DOWNLOAD EBOOKAuthor: Joseph F. Hanlon
Publisher: CRC Press
Published: 1998-04-23
Total Pages: 701
ISBN-13: 1498731937
DOWNLOAD EBOOKNow in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete guide also provides information on recent changes in
Author: Michael Baker
Publisher: Macmillan Education AU
Published: 1998
Total Pages: 564
ISBN-13: 9780732952112
DOWNLOAD EBOOK"Marketing: Managerial Foundations" provides students with a sound understanding of marketing theory and practice, and does so in an Australian and New Zealand context. It is an introductory text that goes beyond the prescriptive approach. It seeks to meet the needs of a discipline that is now accepted as a fundamental aspect of business and one which needs and deserves an academic base of context, concept and application. No theoretical stone is left unturned as good practice is supported by essential theoretical frameworks. Students will find more discussion of the various arguments that provide views on the foundations and application of marketing. Concepts such as relationship marketing are traced and explored. The book provides a strong foundation for the study of marketing and is essential reading for the newcomer to marketing as well as being a valuable reference for the marketing professional.
