Applications of Synchrotron Radiation Techniques to Materials Science IV: Volume 524
Applications of Synchrotron Radiation Techniques to Materials Science IV: Volume 524

Author: Susan M. Mini

Publisher:

Published: 1998-08-17

Total Pages: 408

ISBN-13:

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The 57 papers update the status of characterization techniques that use synchrotron radiation since the previous symposium on the subject in the spring of 1996. The techniques considered include X-ray absorption and scattering, imaging, tomography, microscopy, and topographic methods. Among the materials are surfaces, interfaces, electronic materials, metal oxides, solar cells, thin films, carbides, polymers, alloys, nanoparticles, and graphitic materials. Some of the papers are doubled spaced. Annotation copyrighted by Book News, Inc., Portland, OR

Dynamics in Small Confining Systems IV: Volume 543
Dynamics in Small Confining Systems IV: Volume 543

Author: J. M. Drake

Publisher:

Published: 1999-07-15

Total Pages: 392

ISBN-13:

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This book, the fourth in a series from the Materials Research Society, follows the tradition of earlier volumes in the series and covers a broad range of topics relating to structure and dynamics under geometric restrictions. Emphasis is on methods of probing confined systems, diffusion in porous media, polymers and membranes, dielectric and mechanical relaxation in nanopores, rheology and friction studies of embedded liquids, and properties of dendrimer supermolecules. Participants from many varied disciplines share their points of view on the fundamental questions of how spatial restrictions modify a system to behave significantly different than in bulk, how this difference relates to the molecular properties, and how it can be probed.

III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535
III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535

Author: S. A. Ringel

Publisher:

Published: 1999-08-11

Total Pages: 338

ISBN-13:

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This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.

Electronic Packaging Materials Science X: Volume 515
Electronic Packaging Materials Science X: Volume 515

Author: Daniel J. Belton

Publisher:

Published: 1998-10

Total Pages: 288

ISBN-13:

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Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR