Scientific and Technical Aerospace Reports

Scientific and Technical Aerospace Reports

Author:

Publisher:

Published: 1994

Total Pages: 804

ISBN-13:

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Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.


Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences

Author: Wade H. Shafer

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 386

ISBN-13: 1461573912

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Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thougtit that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 31 (thesis year 1986) a total of 11 ,480 theses titles trom 24 Canadian and 182 United States universities. We are sure that this broader base tor these titles reported will greatly enhance the value ot this important annual reterence work. While Volume 31 reports theses submitted in 1986, on occasion, certain univer sities do re port theses submitted in previousyears but not reported at the time.


Electronic Properties of Materials

Electronic Properties of Materials

Author: Rolf E. Hummel

Publisher: Springer Science & Business Media

Published: 2013-06-29

Total Pages: 411

ISBN-13: 3662029545

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It is quite satisfying for an author to learn that his brainchild has been favorably accepted by students as well as by professors and thus seems to serve some useful purpose. This horizontally integrated text on the electronic properties of metals, alloys, semiconductors, insulators, ceramics, and poly meric materials has been adopted by many universities in the United States as well as abroad, probably because of the relative ease with which the material can be understood. The book has now gone through several re printing cycles (among them a few pirate prints in Asian countries). I am grateful to all readers for their acceptance and for the many encouraging comments which have been received. I have thought very carefully about possible changes for the second edition. There is, of course, always room for improvement. Thus, some rewording, deletions, and additions have been made here and there. I withstood, how ever, the temptation to expand considerably the book by adding completely new subjects. Nevertheless, a few pages on recent developments needed to be inserted. Among them are, naturally, the discussion of ceramic (high-tempera ture) superconductors, and certain elements of the rapidly expanding field of optoelectronics. Further, I felt that the readers might be interested in learning some more practical applications which result from the physical concepts which have been treated here.


Reliability of Gallium Arsenide MMICs

Reliability of Gallium Arsenide MMICs

Author: A. Christou

Publisher:

Published: 1992-12-15

Total Pages: 488

ISBN-13:

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A team of internationally renowned experts contribute articles which emphasize the reliability and quality issues inherent in all phases of systems design. Coverage includes fundamental failure modes of each of the device building blocks, packaged MMIC modules, current practical aspects of reliability testing and much more.