Advances in Chemical-Mechanical Polishing: Volume 816
Advances in Chemical-Mechanical Polishing: Volume 816

Author: Materials Research Society. Meeting

Publisher:

Published: 2004-09

Total Pages: 318

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).

Chemical-Mechanical Planarization: Volume 867
Chemical-Mechanical Planarization: Volume 867

Author: A. Kumar

Publisher:

Published: 2005-07-19

Total Pages: 330

ISBN-13:

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Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

Fundamentals of Nanoindentation and Nanotribology III
Fundamentals of Nanoindentation and Nanotribology III

Author: Kathryn J. Wahl

Publisher:

Published: 2005

Total Pages: 444

ISBN-13:

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This volume focuses on methods to measures and model small-volume mechanical and tribological properties. Nanoscale characterization of the mechanical and tribological properties of surfaces is important in many engineering applications.

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004

Author: R. J. Carter

Publisher:

Published: 2004-09

Total Pages: 432

ISBN-13:

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The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.