Advanced Processes for 193-nm Immersion Lithography
Advanced Processes for 193-nm Immersion Lithography

Author: Yayi Wei

Publisher: SPIE Press

Published: 2009

Total Pages: 338

ISBN-13: 0819475572

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This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning.

Nanolithography
Nanolithography

Author: M Feldman

Publisher: Woodhead Publishing

Published: 2014-02-13

Total Pages: 599

ISBN-13: 0857098756

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Integrated circuits, and devices fabricated using the techniques developed for integrated circuits, have steadily gotten smaller, more complex, and more powerful. The rate of shrinking is astonishing – some components are now just a few dozen atoms wide. This book attempts to answer the questions, "What comes next? and "How do we get there?Nanolithography outlines the present state of the art in lithographic techniques, including optical projection in both deep and extreme ultraviolet, electron and ion beams, and imprinting. Special attention is paid to related issues, such as the resists used in lithography, the masks (or lack thereof), the metrology needed for nano-features, modeling, and the limitations caused by feature edge roughness. In addition emerging technologies are described, including the directed assembly of wafer features, nanostructures and devices, nano-photonics, and nano-fluidics.This book is intended as a guide to the researcher new to this field, reading related journals or facing the complexities of a technical conference. Its goal is to give enough background information to enable such a researcher to understand, and appreciate, new developments in nanolithography, and to go on to make advances of his/her own. - Outlines the current state of the art in alternative nanolithography technologies in order to cope with the future reduction in size of semiconductor chips to nanoscale dimensions - Covers lithographic techniques, including optical projection, extreme ultraviolet (EUV), nanoimprint, electron beam and ion beam lithography - Describes the emerging applications of nanolithography in nanoelectronics, nanophotonics and microfluidics

Polymers and Electromagnetic Radiation
Polymers and Electromagnetic Radiation

Author: Wolfram Schnabel

Publisher: John Wiley & Sons

Published: 2014-01-10

Total Pages: 361

ISBN-13: 3527677739

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This first book to cover the interaction of polymers with radiation from the entire electromagnetic spectrum adopts a multidisciplinary approach to bridge polymer chemistry and physics, photochemistry, photophysics and materials science. The text is equally unique in its scope, devoting equal amounts of attention to the three aspects of synthesis, characterization, and applications. The first part deals with the interaction of polymers with non-ionizing radiation in the frequency-range from sub-terahertz via infrared radiation to visible and ultraviolet light, while the second covers interaction with ionizing radiation from the extreme ultraviolet to ?-ray photons. The result is a systematic overview of how both types of radiation can be used for different polymerization approaches, spectroscopy methods and lithography techniques. Authored by a world-renowned researcher and teacher with over 40 years of experience in the field, this is a highly practical and authoritative guide.

Materials and Processes for Next Generation Lithography
Materials and Processes for Next Generation Lithography

Author:

Publisher: Elsevier

Published: 2016-11-08

Total Pages: 636

ISBN-13: 0081003587

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As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. - Assembles up-to-date information from the world's premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation - Includes information on processing and metrology techniques - Brings together multiple approaches to litho pattern recording from academia and industry in one place

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

Author: Luciano Lavagno

Publisher: CRC Press

Published: 2017-02-03

Total Pages: 798

ISBN-13: 1482254611

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The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Fundamentals and Applications of Nano Silicon in Plasmonics and Fullerines
Fundamentals and Applications of Nano Silicon in Plasmonics and Fullerines

Author: Munir H. Nayfeh

Publisher: Elsevier

Published: 2018-06-29

Total Pages: 604

ISBN-13: 0323480586

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Fundamentals and Applications of Nano Silicon in Plasmonics and Fullerines: Current and Future Trends addresses current and future trends in the application and commercialization of nanosilicon. The book presents current, innovative and prospective applications and products based on nanosilicon and their binary system in the fields of energy harvesting and storage, lighting (solar cells and nano-capacitor and fuel cell devices and nanoLEDs), electronics (nanotransistors and nanomemory, quantum computing, photodetectors for space applications; biomedicine (substance detection, plasmonic treatment of disease, skin and hair care, implantable glucose sensor, capsules for drug delivery and underground water and oil exploration), and art (glass and pottery). Moreover, the book includes material on the use of advanced laser and proximal probes for imaging and manipulation of nanoparticles and atoms. In addition, coverage is given to carbon and how it contrasts and integrates with silicon with additional related applications. This is a valuable resource to all those seeking to learn more about the commercialization of nanosilicon, and to researchers wanting to learn more about emerging nanosilicon applications. - Features a variety of designs and operation of nano-devices, helping engineers to make the best use of nanosilicon - Contains underlying principles of how nanomaterials work and the variety of applications they provide, giving those new to nanosilicon a fundamental understanding - Assesses the viability of various nanoslicon devices for mass production and commercialization, thereby providing an important source of information for engineers

Variation-Aware Advanced CMOS Devices and SRAM
Variation-Aware Advanced CMOS Devices and SRAM

Author: Changhwan Shin

Publisher: Springer

Published: 2016-06-06

Total Pages: 141

ISBN-13: 9401775974

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This book provides a comprehensive overview of contemporary issues in complementary metal-oxide semiconductor (CMOS) device design, describing how to overcome process-induced random variations such as line-edge-roughness, random-dopant-fluctuation, and work-function variation, and the applications of novel CMOS devices to cache memory (or Static Random Access Memory, SRAM). The author places emphasis on the physical understanding of process-induced random variation as well as the introduction of novel CMOS device structures and their application to SRAM. The book outlines the technical predicament facing state-of-the-art CMOS technology development, due to the effect of ever-increasing process-induced random/intrinsic variation in transistor performance at the sub-30-nm technology nodes. Therefore, the physical understanding of process-induced random/intrinsic variations and the technical solutions to address these issues plays a key role in new CMOS technology development. This book aims to provide the reader with a deep understanding of the major random variation sources, and the characterization of each random variation source. Furthermore, the book presents various CMOS device designs to surmount the random variation in future CMOS technology, emphasizing the applications to SRAM.

Nanoscience
Nanoscience

Author: Neerish Revaprasadu

Publisher: Royal Society of Chemistry

Published: 2024-09-04

Total Pages: 305

ISBN-13: 1837674140

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With a vast landscape of material, careful distillation of the most important discoveries helps researchers find the key information. Publications in nanoscience cross conventional boundaries from chemistry to specialised areas of physics and nanomedicine. This volume provides a critical and comprehensive assessment of the most recent research and opinion from across the globe. Topics covered include, but are not limited to, advancing lithium-ion battery technology, sonochemistry in nanomaterial synthesis, mechanoluminescence and electronic and optical features of 2D materials. Appealing to anyone practising in nano-allied fields or wishing to enter the nano-world, this useful resource provides a succinct reference on recent developments in this area now and looking to the future.

Microlithography
Microlithography

Author: Bruce W. Smith

Publisher: CRC Press

Published: 2020-05-01

Total Pages: 851

ISBN-13: 1439876762

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The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.

Design Rules in a Semiconductor Foundry
Design Rules in a Semiconductor Foundry

Author: Eitan N. Shauly

Publisher: CRC Press

Published: 2022-11-30

Total Pages: 831

ISBN-13: 1000631354

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Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.