This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
This handbook systematically collects the latest scientific and technological knowledge on liquid metals obtained so far in this cutting edge frontier. Conventional materials such as metals, polymers, composites, ceramics and naturally derived matters, may not perform well when facing certain technological challenges. At around room temperature, most of such materials mainly stay at solid state and are often difficult to shape due to their high melting point. Meanwhile, although classical soft matters own good flexibility, their electrical conductivities including more behaviours appear not good enough which generally limited their utilizations. As a game-changing alternative, the room temperature liquid metal materials are quickly emerging as a new generation functional material which displayed many unconventional properties superior to traditional materials. Their outstanding versatile feature as “One material, diverse capabilities” is rather unique among existing materials and thus opens many exciting opportunities for scientific, technological and industrial developments. This handbook presents comprehensive reference information on liquid metal science and technology that are currently available. The major advancements as made before are collected and summarized. Representative liquid metal applications are illustrated. It helps readers obtain a comprehensive understanding of the technical progresses and fundamental discoveries in the frontier, and thus better explore and utilize liquid metal materials to address various challenging needs.
An up-to-date exploration of the properties and most recent applications of liquid metals In Liquid Metal: Properties, Mechanisms, and Applications, a pair of distinguished researchers delivers a comprehensive exploration of liquid metals with a strong focus on their structure and physicochemical properties, preparation methods, and tuning strategies. The book also illustrates the applications of liquid metals in fields as varied as mediated synthesis, 3D printing, flexible electronics, biomedicine, energy storage, and energy conversion. The authors include coverage of reactive mediums for synthesizing and assembling nanomaterials and direct-writing electronics, and the book offers access to supplementary video materials to highlight the concepts discussed within. Recent advancements in the field of liquid metals are also discussed, as are new opportunities for research and development in this rapidly developing area. The book also includes: A thorough introduction to the fundamentals of liquid metal, including a history of its discovery, its structure and physical properties, and its preparation Comprehensive explorations of the external field tuning of liquid metal, including electrical, magnetic, and chemical tuning Practical discussions of liquid metal as a new reaction medium, including nanomaterial synthesis and alloy preparation In-depth examinations of constructing techniques of liquid metal-based architectures, including injection, imprinting, and mask-assisted depositing Perfect for materials scientists, electrochemists, and catalytic chemists, Liquid Metal: Properties, Mechanisms, and Applications also belongs in the libraries of inorganic chemists, electronics engineers, and biochemists.
This book discusses the core principles and practical applications of a brand new machine category: liquid-metal soft machines and motors. After a brief introduction on the conventional soft robot and its allied materials, it presents the new conceptual liquid-metal machine, which revolutionizes existing rigid robots, both large and small. It outlines the typical features of the soft liquid-metal materials and describes the various transformation capabilities, mergence of separate metal droplets, self-rotation and planar locomotion of liquid-metal objects under external or internal mechanism. Further, it introduces a series of unusual phenomena discovered while developing the shape changeable smart soft machine and interprets the related mechanisms regarding the effects of the shape, size, voltage, orientation and geometries of the external fields to control the liquid-metal transformers. Moreover, the book illustrates typical strategies to construct a group of different advanced functional liquid-metal soft machines, since such machines or robots are hard to fabricate using rigid-metal or conventional materials. With highly significant fundamental and practical findings, this book is intended for researchers interested in establishing a general method for making future smart soft machine and accompanying robots.
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Dieses Referenzwerk in drei handlichen Bänden bietet einen detaillierten Überblick über Anwendungen der Nanotechnologie im Bereich Nachhaltigkeit in der Energieversorgung. Der erste Band dieses klar strukturierten Nachschlagewerks behandelt nach der Einleitung die Themen Energieerzeugung, erneuerbare Energien, Energiespeicherung, Energieverteilung sowie Energieumwandlung und Energy-Harvesting. Im zweiten Band werden auf Nanotechnologie basierte Materialen, Energieeinsparung und -management, technologische und urheberrechtlich relevante Fragen, Märkte und Umweltsanierung erörtert. Der dritte Band wirft einen Blick in die Zukunft, auf technologische Fortschritte und gibt Empfehlungen. Ein wichtiges Handbuch für alle Experten auf diesem Gebiet, von Forschern und Ingenieuren im wissenschaftlichen Bereich bis hin zu Entwicklern in der Industrie.
The latest volume in the well-established AMN series, this ready reference provides an up-to-date, self-contained summary of recent developments in the technologies and systems for thermoelectricity. Following an initial chapter that introduces the fundamentals and principles of thermoelectricity, subsequent chapters discuss the synthesis and integration of various bulk thermoelectric as well as nanostructured materials. The book then goes on to discuss characterization techniques, including various light and mechanic microscopy techniques, while also summarizing applications for thermoelectric materials, such as micro- and nano-thermoelectric generators, wearable electronics and energy conversion devices. The result is a bridge between industry and scientific researchers seeking to develop thermoelectric generators.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
This book summarizes a five year research project, as well as subsequent results regarding high power diode laser systems and their application in materials processing. The text explores the entire chain of technology, from the semiconductor technology, through cooling mounting and assembly, beam shaping and system technology, to applications in the processing of such materials as metals and polymers. Includes theoretical models, a range of important parameters and practical tips.
Maximum PC is the magazine that every computer fanatic, PC gamer or content creator must read. Each and every issue is packed with punishing product reviews, insightful and innovative how-to stories and the illuminating technical articles that enthusiasts crave.
