Advanced Gate Stack Materials and Processes for Sub-nm CMOS Applications
Author: Qiang Lu
Publisher:
Published: 2003
Total Pages: 145
ISBN-13:
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Author: Qiang Lu
Publisher:
Published: 2003
Total Pages: 145
ISBN-13:
DOWNLOAD EBOOKAuthor: Qiang Lu
Publisher:
Published: 2002
Total Pages: 320
ISBN-13:
DOWNLOAD EBOOKAuthor: P. J. Timans
Publisher: The Electrochemical Society
Published: 2008-05
Total Pages: 488
ISBN-13: 1566776260
DOWNLOAD EBOOKThis issue describes processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author:
Publisher:
Published: 2005
Total Pages: 658
ISBN-13:
DOWNLOAD EBOOKAuthor: E. P. Gusev
Publisher: The Electrochemical Society
Published: 2010-04
Total Pages: 426
ISBN-13: 1566777917
DOWNLOAD EBOOKThese proceedings describe processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author: V. Narayanan
Publisher: The Electrochemical Society
Published: 2009-05
Total Pages: 367
ISBN-13: 1566777097
DOWNLOAD EBOOKThis issue of ¿ECS Transactions¿ describes processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics include strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author: Fred Roozeboom
Publisher: The Electrochemical Society
Published: 2006
Total Pages: 472
ISBN-13: 1566775027
DOWNLOAD EBOOKThese proceedings describe processing, materials, and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author: Pushkar Sharad Ranade
Publisher:
Published: 2002
Total Pages: 276
ISBN-13:
DOWNLOAD EBOOKAuthor: Athanasios Dimoulas
Publisher: Springer Science & Business Media
Published: 2008-01-01
Total Pages: 397
ISBN-13: 354071491X
DOWNLOAD EBOOKThis book provides a comprehensive monograph on gate stacks in semiconductor technology. It covers the major latest developments and basics and will be useful as a reference work for researchers, engineers and graduate students alike. The reader will get a clear view of what has been done so far, what is the state-of-the-art and which are the main challenges ahead before we come any closer to a viable Ge and III-V MOS technology.
Author: Yee-Chia Yeo
Publisher:
Published: 2002
Total Pages: 358
ISBN-13:
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