First published in 1996. ADHESION INTERNATIONAL 1993 is a volume of the Proceedings of the 16th Annual Meeting of The Adhesion Society, Inc. Williamsburg, Virginia, USA February 21-26,1993. This meeting featured an International Symposium on The Interphase. Interphases are extremely important in many areas of technology. They are formed when dissimilar materials are joined and they control the properties of adhesive joints, composites, coatings, and microelectronics devices. Considering the importance and scope of phenomena associated with the interphase, it was appropriate to convene such a symposium at the meeting.
First published in 1996. ADHESION INTERNATIONAL 1993 is a volume of the Proceedings of the 16th Annual Meeting of The Adhesion Society, Inc. Williamsburg, Virginia, USA February 21-26,1993. This meeting featured an International Symposium on The Interphase. Interphases are extremely important in many areas of technology. They are formed when dissimilar materials are joined and they control the properties of adhesive joints, composites, coatings, and microelectronics devices. Considering the importance and scope of phenomena associated with the interphase, it was appropriate to convene such a symposium at the meeting.
This Festschrift documents the Proceedings of the First International Congress on Adhesion Science and Technology, held in honor of Dr. Kash Mittal on the occasion of his 50 birthday, in Amsterdam, The Netherlands, October 16-20, 1995. It contains the full accounts of the plenary and invited lectures, which are divided into the following seven parts: Part 1: Fundamental aspects of adhesion and general topics; Part 2: Contact angle, wettability and surface energetics; Part 3: Surface modification: Relevance to adhesion; Part 4: Adhesives and adhesive joints; Part 5: Adhesion aspects of polymeric coatings, and polymer-polymer interphase; Part 6: Metal-polymer and metal-ceramic adhesion; and Part 7: General papers. The topics covered include many different aspects of adhesion science and technology, and both fundamental and applied issues are addressed. The final section of this volume gives a listing of titles, authors and affiliations of the other 185 papers which were included in the technical program of the conference.
The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion and removal. 2. Mechanisms of particle adhesion and removal. 3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions. 4. Mechanics of adhesion of micro- and nanoscale particles. 5. Various factors affecting particle adhesion to a variety of substrates. 6. Surface modification techniques to modulate particle adhesion. 7. Various cleaning methods (both wet & dry) for particle removal. 8. Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated.
This book chronicles the proceedings of the Second International Symposium on Polymer Surface Modification: Relevance to Adhesion held Newark, New Jersey, May 24--26, 1999. Polymeric materials are intrinsically not very adhesionable and this necessitates their surface treatment to enhance their adhesion characteristics to other materials. Since the first symposium on this topic, held in 1993, there has been a tremendous R&D activity in devising novel or ameliorating the existing techniques for surface modification of polymers. This volume contains a total of 32 papers, which have been rigorously peer-reviewed and suitably revised before inclusion in this volume. The book is divided into three parts as follows. Part 1: Plasma Surface Modification Techniques; Part 2: Other/Miscellaneous Surface Modification Techniques; and Part 3: General Papers. The topics covered include: plasma surface modification of a variety of polymers using various plasma gases; atmospheric plasma system; surface functionalization; ultrahydrophobic polymeric surfaces; metallization of plasma treated polymers; surface modification of polymers via molecular design for adhesion promotion; wet chemical methods for polymer surface modification; laser surface modification of various polymers; UV/ozone treatment; surface and interface studies of treated polymer surfaces by an array of techniques; bioadhesion of polymeric biomaterials to tissue; polymer-fiber systems; and plasma deposited coatings.
Adhesions can cause a wide range of problems, complaints and hazards, even after simple abdominal procedures, such as appendectomy, with complications ranging from recurrent discomfort and pain to intestinal obstruction. Postsurgical adhesions increase the risk of following operations of the abdominal and thoracic cavity. They impair peritoneal dialysis and chemotherapy and play a crucial part in laparoscopic procedures. Adhesion-related problems account for a large amount of clinical work and have a significant socioeconomic impact. This book presents the current knowledge on the aetiopathogenesis of adhesion formation as well as the available methods for their prevention and control. Experts in the field contribute to clinical standards for preventive measures to control the formation of postoperative adhesions
Handbook of Thermoset Plastics, Fourth Edition provides complete coverage of the chemical processes, manufacturing techniques and design properties of each polymer, along with its applications. This new edition has been expanded to include the latest developments in the field, with new chapters on radiation curing, biological adhesives, vitrimers, and 3D printing. This detailed handbook considers the practical implications of using thermoset plastics and the relationships between processing, properties and applications, as well as analyzing the strengths and weakness of different methods and applications.The aim of the book is to help the reader to make the right decision and take the correct action on the basis of informed analysis – avoiding the pitfalls the authors' experience has uncovered. In industry, the book supports engineers, scientists, manufacturers and R&D professionals working with plastics. The information included will also be of interest to researchers and advanced students in plastics engineering, polymer chemistry, adhesives and coatings. - Offers a systematic approach, guiding the reader through chemistry, processing methods, properties and applications of thermosetting polymers - Includes thorough updates that discuss current practice and the new developments on biopolymers, nanotechnology, 3D printing, radiation curing and biological adhesives - Uses case studies to demonstrate how particular properties make different polymers suitable for different applications - Covers end-use and safety considerations
Micro Electro Mechanical Systems (MEMS) is already about a billion dollars a year industry and is growing rapidly. So far major emphasis has been placed on the fabrication processes for various devices. There are serious issues related to tribology, mechanics, surfacechemistry and materials science in the operationand manufacturingof many MEMS devices and these issues are preventing an even faster commercialization. Very little is understood about tribology and mechanical properties on micro- to nanoscales of the materials used in the construction of MEMS devices. The MEMS community needs to be exposed to the state-of-the-artoftribology and vice versa. Fundamental understanding of friction/stiction, wear and the role of surface contamination and environmental debris in micro devices is required. There are significantadhesion, friction and wear issues in manufacturing and actual use, facing the MEMS industry. Very little is understood about the tribology of bulk silicon and polysilicon films used in the construction ofthese microdevices. These issues are based on surface phenomenaand cannotbe scaled down linearly and these become increasingly important with the small size of the devices. Continuum theory breaks down in the analyses, e. g. in fluid flow of micro-scale devices. Mechanical properties ofpolysilicon and other films are not well characterized. Roughness optimization can help in tribological improvements. Monolayers of lubricants and other materials need to be developed for ultra-low friction and near zero wear. Hard coatings and ion implantation techniques hold promise.
Adhesive Bonding: Science, Technology and Applications, Second Edition guides the reader through the fundamentals, mechanical properties and applications of adhesive bonding. This thoroughly revised and expanded new edition reflects the many advances that have occurred in recent years. Sections cover the fundamentals of adhesive bonding, explaining how adhesives and sealants work, and how to assess and treat surfaces, how adhesives perform under stress and the factors affecting fatigue and failure, stress analysis, environmental durability, non-destructive testing, impact behavior, fracture mechanics, fatigue, vibration damping, and applications in construction, automotive, marine, footwear, electrical engineering, aerospace, repair, electronics, biomedicine, and bonding of composites. With its distinguished editor and international team of contributors, this book is an essential resource for industrial engineers, R&D, and scientists working with adhesives and their industrial applications, as well as researchers and advanced students in adhesion, joining, polymer science, materials science and mechanical engineering. - Offers detailed, methodical coverage of the fundamentals, mechanical properties and industrial applications of adhesive bonding - Enables the successful preparation of adhesives for a broad range of important load-bearing applications in areas such as automotive and aerospace, construction, electronics and biomedicine - Covers the latest advances in adhesive bonding, including improved repair techniques for metallic and composite structures, cohesive zone modeling, and disassembly and recycling
