This book chronicles the proceedings of the First International Symposium on Adhesion Aspects of Thin Films, held in Newark, New Jersey, October 28-29, 1999. Films and coatings are used for a variety of purposes a decorative, protective, functional, etc. a in a host of applications. Irrespective of the intended function or application of a film
This book chronicles the proceedings of the First International Symposium on Adhesion Aspects of Thin Films, held in Newark, New Jersey, October 28-29, 1999. Films and coatings are used for a variety of purposes – decorative, protective, functional, etc. – in a host of applications. Irrespective of the intended function or application of a film or a coating, their adequate adhesion to the underlying substrates is of cardinal importance. Concomitantly, the need to understand the factors controlling adhesion and to tailor adhesion to a desired level is quite patent. This book contains a total of 16 papers, which were presented by researchers from academia, industry and other laboratories, and have been rigorously peer reviewed, suitably revised and properly edited before inclusion. The topics covered include: mechanisms, origin, evolution and measurement of stresses in thin films; surface stress effects on the intrinsic stress; various factors affecting stresses in thin films; delamination of coatings caused by residual stress; effects of surface treatments on the adhesion of metallic films; adhesion of CVD diamond to carbide cutting inserts; effect of carbon contaminant on adhesion of aluminum films; effect of interlayers on adhesion of ceramic coatings; effect of residual stress on adhesion and wear resistance of hard coatings; tribological properties of ceramic films; oxide layers as barrier coatings on a plastic substrate; adhesion aspects of organic coatings to metals; and adhesion of thin plasma polymerized fluorocarbon films.This book, providing a commentary on the current state of knowledge of adhesion of thin films, will be useful to anyone interested in thin films and will provide ideas on how to improve or tailor adhesion of a film or a coating for a given situation.
This volume documents the proceedings of the International Symposium on Adhesion Aspects of Thin Films (including Adhesion Measurement, and Metallized plastics) held in Orlando, FL, December 15-16, 2003.This volume is divided into three parts. Part 1 a General Papersa ; Part 2 a Metallized Plasticsa ; and Part 3 a Adhesion Measurementa. The top
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
This volume documents the proceedings of the International Symposium on Adhesion Aspects of Thin Films (including Adhesion Measurement, and Metallized plastics) held in Orlando, FL, December 15-16, 2003. This volume is divided into three parts. Part 1 “General Papers”; Part 2 “Metallized Plastics”; and Part 3 “Adhesion Measurement”. The topics covered include: Factors influencing adhesion of thin films; relevance of stresses in film adhesion; surface effects on intrinsic thin film stresses; adhesion improvement; hemocompatibility of DLC coatings; thin films of various materials on a host of substrates; thin polymer films; surface modification of polymers; adhesion of metal films on polymers; investigation of metal-polymer interactions; adhesion measurement; scratch test; microscratch test; and abrasion and durability of thin films.
Thin films have an extremely broad range of applications from electronics and optics to new materials and devices. Collaborative and multidisciplinary efforts from physicists, materials scientists, engineers and others have established and advanced a field with key pillars constituting (i) the synthesis and processing of thin films, (ii) the understanding of physical properties in relation to the nanometer scale, (iii) the design and fabrication of nano-devices or devices with thin film materials as building blocks, and (iv) the design and construction of novel tools for characterization of thin films.Against the backdrop of the increasingly interdisciplinary field, this book sets off to inform the basics of thin film physics and thin film devices. Readers are systematically introduced to the synthesis, processing and application of thin films; they will also study the formation of thin films, their structure and defects, and their various properties — mechanical, electrical, semiconducting, magnetic, and superconducting. With a primary focus on inorganic thin film materials, the book also ventures on organic materials such as self-assembled monolayers and Langmuir-Blodgett films.This book will be effective as a teaching or reference material in the various disciplines, ranging from Materials Science and Engineering, Electronic Science and Engineering, Electronic Materials and Components, Semiconductor Physics and Devices, to Applied Physics and more. The original Chinese publication has been instrumental in this purpose across many Chinese universities and colleges.
Physics of Thin Films has been one of the longest running continuing series in thin film science consisting of 20 volumes since 1963. The series contains some of the highest quality studies of the properties ofvarious thin films materials and systems.In order to be able to reflect the development of todays science and to cover all modern aspects of thin films, the series, beginning with Volume 20, will move beyond the basic physics of thin films. It will address the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.Edited by Abraham Ulman, Organic Thin Films and Surfaces: Directions for the Nineties will be the first volume to link two dynamic areas in the physical sciences--organic thin films and surface science. Contributions from leading experts in the field cover a range of important topics on the processing, characterization, and applications of organic thin films.
