Additive Manufacturing Techniques to Enhance the Performance of Electronics Created on Flexible AndRigid Substrates
Additive Manufacturing Techniques to Enhance the Performance of Electronics Created on Flexible AndRigid Substrates

Author: Aamir Hamed Hamad

Publisher:

Published: 2020

Total Pages: 168

ISBN-13:

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Different additive manufacturing (AM) methods including fused deposition modeling (FDM) and piezoelectrical drop on demand (DOD) inkjet printing have been used in printed electronics for easy production, easy integration, better performance, and low cost. These methods have been used in producing everyday smart printed electronics such as conformal antennas (planner and non-planar antennas), sensors, actuators, and solar cells created on flexible and rigid substrates. The performance of printed electronics strongly depends on printing techniques and printing resolution that enhance their electrical and mechanical properties. In this dissertation, 3D and surface printing techniques were used to enhance the performance of printed electronics devices fabricated on rigid and flexible substrates. First, fused deposition modeling (FDM) technique was used to study the effect of 3D printed heterogeneous substrates on radio frequency response of microstrip patch antennas. Microstrip patch antennas created on acrylonitrile butadiene styrene (ABS) substrates that were designed by 3D CAD design software (SOLIDWORKS) with dimension 50mm x 50mm x 5mm and fabricated with different machine infill densities 25%, 50%, and 75% using FDM 3D printer. Then, 3D X-ray microscope was used to measure the actual volume fraction and construct equivalent simulations for series and parallel equivalent dielectrics constant. The patch antennas were tested for resonant frequency using a vector network analyzer (VNA) combined with ANSYS-HFSS simulation that was developed based on the permittivity anisotropy in 3D printed heterogeneous substrates to estimate the bulk permittivity of ABS material and study the effect of varying the dielectric constant in lateral and thickness direction. Also, microstrip patch antenna with dimension 30mm x 25mm, was modeled on polydimethylsiloxane (PDMS) substrate with the same dimension of ABS substrate and analyzed for resonant frequency using Ansoft HFSS and COMSOL Multiphysics software. Then, COMSOL Multi-physics software was used to study the behavior of the microstrip patch antenna under different values of compression and bending loads to check the feasibility of using the microstrip patch antenna as a passive sensor to detect the strain in the structure wirelessly. Second, piezoelectrical drop on demand (DOD) inkjet printing was used to print uniform and even high conductive nanosilver ink on rigid and flexible substrates. For surface printing, Jetlab 4xl was used to print lines of high conductive nanosilver ink (UTDAg) on semicrystalline polyether ether ketone (PEEK) substrate using fly mode printing with burst. Then, optimal bipolar waveform was generated at proper jetting parameters to generate ideal droplet in term of velocity, size, and uniformity. The ideal droplet was ejected at different drop spacing and stage velocity to print uniform and even lines. Physical and adhesion characteristics of the printed lines were performed by optical microscopy, scanning electron microscopy, surface profilometry, and soak tests. Also, the effect of high stage velocity printing on the spread behavior of ejected droplet with different droplet spacing on Kapton substrate was studied by printing lines using two bipolar waveforms. The resistance of printed lines were measured at different curing temperature. Finally, the effect of driving waveforms at different jetting parameters on the size and velocity of generated droplet was investigated using smartink (nanosilver ink) produced by Genes'Ink. A new method was developed to measure the size of the generated droplet and recognize weather the droplet has a spherical or an elliptical shape by using Python programming and the result compared with Aphelion imaging software. Finally, lines printed at three waveform voltages on PEEK and glass substrates.

Printed Electronics Technologies
Printed Electronics Technologies

Author: Wei Wu

Publisher: Royal Society of Chemistry

Published: 2022-07-20

Total Pages: 685

ISBN-13: 1839167181

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Modern printing technology has paved the way for the fabrication of thin inexpensive electronics and is now established as a topic taught on advanced level courses across materials science and engineering. The properties of printed electronics, such as thin-form factor, flexibility, stretchability, portability, and rollability mean that they have a wide range of applications, including in wearable devices, smart packaging, healthcare, and the automotive industry. This book describes the key printing technologies for printed electronics. Chapters cover principles and mechanisms, techniques, inorganic and organic materials, substrates, post-treatment and applications of printed electronics technologies. Written by a leader in the field, this title will be essential reading for students on courses across materials science, electronics science, manufacturing and engineering, as well as those with an interest in printed electronics.

185 Businesses for Electronics Components
185 Businesses for Electronics Components

Author: Mansoor Muallim

Publisher: M M Infocare

Published:

Total Pages: 376

ISBN-13:

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Accelerometer Manufacturing 1. Market Overview: The global accelerometer manufacturing industry has experienced significant growth over the past few years, driven by the increasing demand for accurate motion sensing devices across various sectors such as automotive, aerospace, healthcare, and consumer electronics. Accelerometers have become essential components in a wide range of applications, including navigation systems, gaming consoles, and wearable devices. The market is characterized by rapid technological advancements, leading to the development of smaller, more precise, and energy-efficient accelerometers. 2. Market Segmentation: The market for accelerometers can be segmented based on technology (MEMS-based accelerometers, piezoelectric accelerometers, and others), application (automotive, aerospace, industrial, healthcare, consumer electronics, and others), and geography. MEMS-based accelerometers dominate the market share due to their compact size, low cost, and high accuracy, making them ideal for various applications. 3. Regional Analysis: • North America: The United States and Canada lead the market due to the presence of key manufacturers and technological advancements in the region. • Europe: Countries like Germany, France, and the United Kingdom are major contributors, driven by the automotive and aerospace industries. • Asia-Pacific: China, Japan, and South Korea are witnessing significant growth, fueled by the expanding consumer electronics market and increasing investments in research and development. 4. Market Drivers: • Technological Advancements: Ongoing research and development activities are leading to the introduction of advanced accelerometers, enhancing their sensitivity and accuracy. • Growing Automotive Industry: Increasing demand for accelerometers in automotive safety systems, vehicle navigation, and stability control systems is driving market growth. • Rising IoT Adoption: Accelerometers are integral to IoT devices, boosting demand for motion sensing components. • Healthcare Applications: Accelerometers play a crucial role in medical devices, wearable health monitors, and telemedicine, contributing to market expansion. 5. Market Challenges: • Intense Competition: The market is highly competitive with numerous established players, leading to price wars and margin pressures. • Supply Chain Disruptions: Global supply chain disruptions and shortages of raw materials can hinder manufacturing processes. • Regulatory Compliance: Adherence to stringent regulations and quality standards poses challenges for manufacturers. 6. Opportunities: • Emerging Economies: Untapped markets in developing countries offer significant growth opportunities for accelerometer manufacturers. • Smart Industry: Accelerometers are vital for predictive maintenance in smart manufacturing, opening avenues for market expansion. • Collaborative Partnerships: Collaborations with technology companies and research institutions can lead to innovative product developments. 7. Future Outlook: The accelerometer manufacturing industry is poised for substantial growth, driven by the proliferation of IoT devices, advancements in sensor technologies, and the increasing integration of accelerometers in emerging applications such as virtual reality and robotics. As industries continue to demand precise motion sensing solutions, the market is anticipated to witness steady growth globally. Conclusion: In conclusion, the global accelerometer manufacturing industry is thriving amid technological innovations and increasing applications across diverse sectors. While challenges exist, strategic partnerships, innovation, and market diversification will be key to overcoming these hurdles. Manufacturers must focus on research and development, quality assurance, and exploring new market segments to stay competitive and capitalize on the growing demand for accurate motion sensing devices worldwide.

Additive Manufacturing for Electronic Systems (AMES)
Additive Manufacturing for Electronic Systems (AMES)

Author: Mohd Ifwat Mohd Ghazali

Publisher:

Published: 2019

Total Pages: 185

ISBN-13: 9780438966222

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Over the last few decades, a significant interest towards the manufacturing of complex three-dimensional (3D) structures for conceptual models have led to an incredible amount of research and development. 3D structures have been an integral part of physical models or functional end-products and are widely adapted as a miniaturizing technique in manufacturing industries, and in particular, the electronics industry. Advancement in electronics technology has lead to the need for fabricating consumable electronics within a smaller lattice space. To meet the challenge of high functional density integration, Additive Manufacturing (AM) techniques by 3D printing is a promising solution for satisfying the ever-increasing demand for a higher quality product with the ability to customize based on an individual customer needs. AM techniques allows the possibility of developing low cost, multifunctional, compact, lightweight, and miniaturized electronics that can be easily integrated with conventional systems or platforms. In this dissertation, approaches towards utilizing existing AM techniques for fabricating structures that are compatible to carry electrical functionality for RF applications is proposed. The end goal is to develop processes using AM technique as an alternate manufacturing approach to achieve a fully functional electronics system. Specifically, AM holds significant potential in realizing low-loss, high-performance, and light-weight RF components such as transmission lines, waveguides, resonators, filters, and antennas. In order to realize a complete RF system by AM, multiple processes are developed. First, to establish connection for allowing electrical functionality, conductive traces must be patterned on the substrate. Two different metal patterning techniques for selectively patterning conductive traces on the 3D printed substrate is developed. Next, to realize a compact system, a smaller form factor is a necessity and this can be achieved by utilizing the flexibility in the third dimension (z-axis) in designing non-planar RF structures. A number of non-planar RF structures are demonstrated showcasing the advantages of AM in fabricating compact designs. Moreover, for fabricating efficient RF circuits, the losses associated with the printed plastics should be minimized. The currently available printing polymers have high dielectric loss and hence an alternative process that utilizes air as a substrate is developed by using a LEGO-like self-alignment procedure in which the structure is printed in multiple parts and snapped together face to face to integrate the complete structure. Furthermore, a number of active and passive components must be integrated into the printed plastic to achieve a RF system. For this purpose, three different solder-free embedding processes are developed to embedded active devices such as diodes into the 3D printed plastics. Finally, a combination of the above-mentioned processes is utilized to achieve a fully 3D printed electronics system and a potential application of such multi-functional system is demonstrated. Overall, this work demonstrates that 3D printing can be adopted in the fabrication of microwave and millimeter wave high functional density circuits and systems.

More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors

Author: Francesca Iacopi

Publisher: Springer Nature

Published: 2023-02-17

Total Pages: 271

ISBN-13: 3031216105

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This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

The Flexible Electronics Opportunity
The Flexible Electronics Opportunity

Author: National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics

Publisher: National Academies Press

Published: 2014

Total Pages: 0

ISBN-13: 9780309305914

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Flexible electronics describes circuits that can bend and stretch, enabling significant versatility in applications and the prospect of low-cost manufacturing processes. They represent an important technological advance, in terms of their performance characteristics and potential range of applications, ranging from medical care, packaging, lighting and signage, consumer electronics and alternative energy (especially solar energy.) What these technologies have in common is a dependence on efficient manufacturing that currently requires improved technology, processes, tooling, and materials, as well as ongoing research. Seeking to capture the global market opportunity in flexible electronics, major U.S. competitors have initiated dedicated programs that are large in scope and supported with significant government funding to develop and acquire these new technologies, refine them, and ultimately manufacture them within their national borders. These national and regional investments are significantly larger than U.S. investment and more weighted toward later stage applied research and development. The Flexible Electronics Opportunity examines and compares selected innovation programs both foreign and domestic, and their potential to advance the production of flexible electronics technology in the United States. This report reviews the goals, concept, structure, operation, funding levels, and evaluation of foreign programs similar to major U.S. programs, e.g., innovation awards, S&T parks, and consortia. The report describes the transition of flexible electronics research into products and to makes recommendations to improve and to develop U.S. programs. Through an examination of the role of research consortia around the world to advance flexible electronics technology, the report makes recommendations for steps that the U.S. might consider to develop a robust industry in the United States. Significant U.S. expansion in the market for flexible electronics technologies is not likely to occur in the absence of mechanisms to address investment risks, the sharing of intellectual property, and the diverse technology requirements associated with developing and manufacturing flexible electronics technologies. The Flexible Electronics Opportunity makes recommendations for collaboration among industry, universities, and government to achieve the critical levels of investment and the acceleration of new technology development that are needed to catalyze a vibrant flexible electronics industry.

Additive Manufacturing Technologies
Additive Manufacturing Technologies

Author: Ian Gibson

Publisher: Springer Nature

Published: 2020-11-10

Total Pages: 685

ISBN-13: 3030561275

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This textbook covers in detail digitally-driven methods for adding materials together to form parts. A conceptual overview of additive manufacturing is given, beginning with the fundamentals so that readers can get up to speed quickly. Well-established and emerging applications such as rapid prototyping, micro-scale manufacturing, medical applications, aerospace manufacturing, rapid tooling and direct digital manufacturing are also discussed. This book provides a comprehensive overview of additive manufacturing technologies as well as relevant supporting technologies such as software systems, vacuum casting, investment casting, plating, infiltration and other systems. Reflects recent developments and trends and adheres to the ASTM, SI and other standards; Includes chapters on topics that span the entire AM value chain, including process selection, software, post-processing, industrial drivers for AM, and more; Provides a broad range of technical questions to ensure comprehensive understanding of the concepts covered.

Handbook of Visual Display Technology
Handbook of Visual Display Technology

Author: Janglin Chen

Publisher: Springer

Published: 2012-01-23

Total Pages: 2700

ISBN-13: 9783540795681

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This handbook offers a comprehensive description of the science, technology, economic and human interface factors associated with the displays industry. With expert contributions from over 150 international display professionals and academic researchers, it covers all classes of display device and discusses established principles, emergent technologies, and particular areas of application.