ICEPT 2018 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China
We are delighted to provide the proceedings of the sixth International Conference on Applied Engineering (ICAE), 2023, which was conducted in Batam on November 7th, 2023. This conference, which has as its theme "Synergizing Green Economy, Sustainable Development, and Digitalization for a Prosperous Future," is a significant international assembly that seeks to integrate technological innovation, economic expansion, and environmental sustainability. An ensemble of stakeholders, comprising policymakers, entrepreneurs, and experts, assembles to examine the mutually beneficial correlation that exists between digital advancements and a green economy. The acceptance rate for ICAE 2023 stands at 25%, leading to the selection of 28 substantial papers. The conference featured three distinct tracks: Informatics, Electronics, and Mechanicals. Two keynote addresses were delivered in conjunction with the outstanding technical paper presentations at the technical program. The keynote addresses were delivered by Dr. Ir. Basuki Rahmatul Alam, Chair of the IEEE EDS Indonesia Chapter and Senior Member of IEEE, and Dr. MK Radhakrishnan, Technical Consultant at NanoRel LLP in Singapore and Vice President of IEEE EDS. Coordination effectiveness with the steering committee was crucial to guaranteeing the conference's success. We wish to convey our profound gratitude for their consistent guidance and support that accompanied the entire undertaking. The ICAE Chair Committee deserves special recognition for their conscientiousness in finalizing the peer-review procedure of technical papers, which ultimately led to the creation of a technical program of exceptional quality. Furthermore, we would like to express our sincere appreciation to the Conference Managers and all the authors who submitted their papers for the ICAE 2023 conference for their invaluable assistance. Additionally, we appreciate the assistance of the EAI staff in facilitating the production of this publication.
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
This book covers a comprehensive range of topics on the physical mechanisms of LEDs (light emitting diodes), scattering effects, challenges in fabrication and efficient enhancement techniques in organic and inorganic LEDs. It deals with various reliability issues in organic/inorganic LEDs like trapping and scattering effects, packaging failures, efficiency droops, irradiation effects, thermal degradation mechanisms, and thermal degradation processes. Features: Provides insights into the improvement of performance and reliability of LEDs Highlights the optical power improvement mechanisms in LEDs Covers the challenges in fabrication and packaging of LEDs Discusses pertinent failures and degradation mechanisms Includes droop minimization techniques This book is aimed at researchers and graduate students in LEDs, illumination engineering, optoelectronics, and polymer/organic materials.
The Global Joint Education Center for Science and Technology (GJEC) at the Graduate School of Science and Technology (GSST) of Kumamoto University has been hosting the International Student Conference on Advanced Science and Technology (ICAST) annually since 2008. The purpose is to encourage international collaboration among postgraduate students and young researchers and to foster cooperative development in education and research with partner universities. ICAST is predominantly organized and overseen by students, offering a valuable opportunity for them to enhance their leadership and communication skills in an international context. Previously, ICAST has been conducted at foreign universities such as Peking University (China), Ewha Womans University (Korea), Ege University (Turkey), Shandong University (China), University of Seoul (Korea), University of Clermont Auvergne (France), National Kaohsiung University of Science and Technology (Taiwan), and De La Salle University (Philippines), in addition to events held at Kumamoto University. We are excited to announce the 18th ICAST, scheduled to take place at the Universitas Hasanuddin, Faculty of Engineering, from September 18 to 20, 2023. All participants will have the opportunity to deliver live oral presentations and showcase posters.
This conference proceeding LNCS 12203 constitutes the refereed proceedings of the 12th International Conference on Cross-Cultural Design, CCD 2020, held as part of HCI International 2020 in Copenhagen, Denmark in July 2020. The conference was held virtually due to the corona pandemic. The total of 1439 papers and 238 posters included in the 40 HCII 2020 proceedings volumes was carefully reviewed and selected from 6326 submissions. The regular papers of DAPI 2020, Distributed, Ambient and Pervasive Interactions, presented in this volume were organized in topical sections named: Design Approaches, Methods and Tools, Smart Cities and Landscapes, Well-being, Learning and Culture in Intelligent Environments and much more.
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
The primary aim of this volume is to provide researchers and engineers from both academic and industry with up-to-date coverage of new results in the field of robotic welding, intelligent systems and automation. The book is mainly based on papers selected from the 2022 International Conference on Robotic Welding, Intelligence and Automation (RWIA’2022) in Shanghai and Lanzhou, China. The articles show that the intelligentized welding manufacturing (IWM) is becoming an inevitable trend with the intelligentized robotic welding as the key technology. The volume is divided into four logical parts: Intelligent Techniques for Robotic Welding, Sensing of Arc Welding Processing, Modeling and Intelligent Control of Welding Processing, as well as Intelligent Control and its Applications in Engineering.
This book presents a summary of the topic of supercooling during crystallization in condensed films. While recent findings are mainly published in English, the foundational classical results were originally published in Russian, with limited accessibility to general readers. The present work is based on a 2019 Ukrainian monograph, "Temperature Stability of the Supercooled Liquid Phase in Condensed Films," which has been extensively revised and expanded. The book includes a detailed analysis of the thermodynamics of supercooled fluids, with updated and expanded sections. Additionally, new results on the supercooling of indium-lead (In-Pb) alloys in contact with amorphous molybdenum and fusible metals in contact with nanocrystalline layers are presented. These layers occupy a middle ground between amorphous (carbon, molybdenum, as-deposited germanium films) and polycrystalline (copper, silver, aluminum) substrates. The book gives particular attention to the peculiarities of contracted geometry conditions, which are natural for multilayered structures and can occur through fusible component segregation at grain boundaries. The analysis of new data has prompted a rethinking of the role of the more refractory layer's microstructure on the crystallization processes of metastable melts. The book includes a thorough discussion of these findings, highlighting the crucial role of the microstructure in the crystallization process. This book is a valuable resource for researchers and students interested in crystallization in thin-film metallic systems. This comprehensive study provides a detailed and authoritative analysis of the thermodynamics of supercooled fluids, and the impact of microstructure on the crystallization processes of metastable melts, making it an essential addition to any academic library.
