From LED to Solid State Lighting
From LED to Solid State Lighting

Author: S. W. Ricky Lee

Publisher: John Wiley & Sons

Published: 2021-09-17

Total Pages: 256

ISBN-13: 1118881559

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FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Copper Wire Bonding
Copper Wire Bonding

Author: Preeti S Chauhan

Publisher: Springer Science & Business Media

Published: 2013-09-20

Total Pages: 254

ISBN-13: 1461457610

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This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Harsh Environment Electronics
Harsh Environment Electronics

Author: Ahmed Sharif

Publisher: John Wiley & Sons

Published: 2019-03-19

Total Pages: 400

ISBN-13: 3527813993

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Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Prognostics and Health Management of Electronics
Prognostics and Health Management of Electronics

Author: Michael G. Pecht

Publisher: John Wiley & Sons

Published: 2018-08-21

Total Pages: 973

ISBN-13: 1119515351

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An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.

Advanced Composite Materials
Advanced Composite Materials

Author: Ashutosh Tiwari

Publisher: John Wiley & Sons

Published: 2016-09-14

Total Pages: 410

ISBN-13: 111924286X

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Composites materials is basically the combining of unique properties of materials to have synergistic effects. A combination of materials is needed to adapt to certain properties for any application area. There is an everlasting desire to make composite materials stronger, lighter or more durable than traditional materials. Carbon materials are known to be attractive in composites because of their combination of chemical and physical properties. In the recent years, development of new composites has been influenced by precision green approaches that restrict hazardous substances and waste created during production. This book ranges from the fundamental principles underpinning the fabrication of different composite materials to their devices, for example, applications in energy harvesting, memory devices, electrochemical biosensing and other advanced composite-based biomedical applications. This book provides a compilation of innovative fabrication strategies and utilization methodologies which are frequently adopted in the advanced composite materials community with respect to developing appropriate composites to efficiently utilize macro and nanoscale features. The key topics are: Pioneer composite materials for printed electronics Current-limiting defects in superconductors High-tech ceramics materials Carbon nanomaterials for electrochemical biosensing Nanostructured ceramics and bioceramics for bone cancer Importance of biomaterials for bone regeneration Tuning hydroxyapatite particles Carbon nanotubes reinforced bioceramic composite Biomimetic prototype interface

Solid State Lighting Reliability Part 2
Solid State Lighting Reliability Part 2

Author: Willem Dirk van Driel

Publisher: Springer

Published: 2017-07-11

Total Pages: 603

ISBN-13: 3319581759

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In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Supercomputing
Supercomputing

Author: Vladimir Voevodin

Publisher: Springer

Published: 2017-03-09

Total Pages: 382

ISBN-13: 331955669X

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This book constitutes the refereed proceedings of the Second Russian Supercomputing Days, RuSCDays 2016, held in Moscow, Russia, in September 2016. The 28 revised full papers presented were carefully reviewed and selected from 94 submissions. The papers are organized in topical sections on the present of supercomputing: large tasks solving experience; the future of supercomputing: new technologies.

Design of 3D Integrated Circuits and Systems
Design of 3D Integrated Circuits and Systems

Author: Rohit Sharma

Publisher: CRC Press

Published: 2018-09-03

Total Pages: 328

ISBN-13: 1351831593

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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

AETA 2015: Recent Advances in Electrical Engineering and Related Sciences
AETA 2015: Recent Advances in Electrical Engineering and Related Sciences

Author: Vo Hoang Duy

Publisher: Springer

Published: 2016-03-09

Total Pages: 885

ISBN-13: 3319272470

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This proceeding book consists of 10 topical areas of selected papers like: telecommunication, power systems, robotics, control system, renewable energy, power electronics, computer science and more. All selected papers represent interesting ideas and state of the art overview. Readers will find interesting papers of those areas about design and implement of dynamic positioning control system for USV, scheduling problems, motor control, backtracking search algorithm for distribution network and others. All selected papers represent interesting ideas and state of art overview. The proceeding book will also be a resource and material for practitioners who want to apply discussed problems to solve real-life problems in their challenging applications. It is also devoted to the studies of common and related subjects in intensive research fields of modern electric, electronic and related technologies. For these reasons, we believe that this proceeding book will be useful for scientists and engineers working in the above-mentioned fields of research applications.