Robotic Microassembly

Robotic Microassembly

Author: Michael Gauthier

Publisher: John Wiley & Sons

Published: 2011-01-14

Total Pages: 295

ISBN-13: 1118060334

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Discover the latest models and methods for robotic microassembly from around the world This book presents and analyzes new and emerging models and methods developed around the world for robotic microassembly, a new and innovative way to produce better microsystems. By exploring everything from the physics of micromanipulation to microassembly to microhandling, it provides the first complete overview and review of this rapidly growing field. Robotic Microassembly is divided into three parts: Part One: Modeling of the Microworld Part Two: Handling Strategies Part Three: Robotic and Microassembly Together, these three parts feature eight chapters contributed by eight different authors. The authors, internationally recognized experts in the field of robotic microassembly, represent research laboratories in Asia, Europe, and North America. As a result, readers get a remarkable perspective on different approaches to robotic microassembly from around the world. Examples provided throughout the chapters help readers better understand how these different approaches work in practice. References at the end of each chapter lead to the primary literature for further investigation of individual topics. Robotic microassembly offers a new, improved way to manufacture high-performance microelectro-mechanical systems (MEMS). Therefore, any professional or student involved in microrobotics, micromechatronics, self-assembly or MEMS will find plenty of novel ideas and methods in this book that set the stage for new approaches to design and build the next generation of MEMS and microproducts.


Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9

Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9

Author: Ram Ekwal Sah

Publisher: The Electrochemical Society

Published: 2007

Total Pages: 863

ISBN-13: 1566775523

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This issue of ECS Transactions contains the papers presented in the symposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectics held May 6-11, 2007 in Chicago. Papers were presented on deposition, characterization and applications of the dielectrics including high- and low-k dielectrics, as well as interface states, device characterization, reliabiliy and modeling.


Ceramic Interconnect Technology Handbook

Ceramic Interconnect Technology Handbook

Author: Fred D. Barlow, III

Publisher: CRC Press

Published: 2018-10-03

Total Pages: 472

ISBN-13: 1351837176

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Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.