Thermal Design of Electronic Equipment
Thermal Design of Electronic Equipment

Author: Ralph Remsburg

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 440

ISBN-13: 1351835912

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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Advanced Thermal Design of Electronic Equipment
Advanced Thermal Design of Electronic Equipment

Author: Ralph Remsburg

Publisher: Springer Science & Business Media

Published: 1998-02-28

Total Pages: 632

ISBN-13: 9780412122712

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With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.

Thermal Design of Electronic Equipment
Thermal Design of Electronic Equipment

Author: Ralph Remsburg

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 395

ISBN-13: 142004236X

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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging

Author: Xingcun Colin Tong

Publisher: Springer Science & Business Media

Published: 2011-01-05

Total Pages: 633

ISBN-13: 1441977597

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Advanced Thermal Design of Electronic Equipment
Advanced Thermal Design of Electronic Equipment

Author: Ralph Remsburg

Publisher: Springer Science & Business Media

Published: 2011-06-27

Total Pages: 618

ISBN-13: 1441985093

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The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.

High Temperature Electronics
High Temperature Electronics

Author: F. Patrick McCluskey

Publisher: CRC Press

Published: 1996-12-13

Total Pages: 354

ISBN-13: 9780849396236

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The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Mechanics And Materials Science - Proceedings Of The 2016 International Conference (Mms2016)
Mechanics And Materials Science - Proceedings Of The 2016 International Conference (Mms2016)

Author: Chin-wang Tao

Publisher: World Scientific

Published: 2017-09-25

Total Pages: 1283

ISBN-13: 9813228180

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The 2016 International Conference on Mechanics and Materials Science (MMS2016) was held in Guangzhou, China on October 15-16, 2016.Aimed at providing an excellent international academic forum for all the researchers and practitioners, the conference attracted a wide spread participation among all over the universities and research institutes. MMS2016 features unique mixed topics of Mechatronics and Automation, Materials Science and Engineering, Materials Properties, Measuring Methods and Applications.This volume consists of 159 peer-reviewed articles by local and foreign eminent scholars, which cover the frontiers and hot topics in the relevant areas.

Microwave Power Amplifier Design with MMIC Modules
Microwave Power Amplifier Design with MMIC Modules

Author: Howard Hausman

Publisher: Artech House

Published: 2018-06-30

Total Pages: 395

ISBN-13: 163081525X

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Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. This cutting-edge book offers engineers practical guidance in selecting the best power amplifier module for a particular application and interfacing the selected module with other power amplifier modules in the system. It also explains how to identify and mitigate peripheral issues concerning the PA modules, SSPAs, and microwave systems. This authoritative volume presents the critical techniques and underpinnings of SSPA design, enabling professionals to optimize device and system performance. Engineers gain the knowledge they need to evaluate the optimum topologies for the design of a chain of microwave devices, including power amplifiers. Additionally, the book addresses the interface between the microwave subsystems and the primary DC power, the control and monitoring circuits, and the thermal and EMI paths. Packed with 240 illustrations and over 430 equations, this detailed book provides the practical tools engineers need for their challenging projects in the field.