A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Surface contamination is of cardinal importance in a host of technologies and industries, ranging from microelectronics to optics to automotive to biomedical. Thus, the need to understand the causes of surface contamination and their removal is very patent. Generally speaking, there are two broad categories of surface contaminants: film-type and particulates. In the world of shrinking dimensions, such as the ever-decreasing size of microelectronic devices, there is an intensified need to understand the behavior of nanoscale particles and to devise ways to remove them to an acceptable level. Particles which were functionally innocuous a few years ago are ôkiller defectsö today, with serious implications for yield and reliability of the components. This book addresses the sources, detection, characterization and removal of both kinds of contaminants, as well as ways to prevent surfaces from being contaminated. A number of techniques to monitor the level of cleanliness are also discussed. Special emphasis is placed on the behaviour of nanoscale particles. The book is amply referenced and profusely illustrated.• Excellent reference for a host of technologies and industries ranging from microelectronics to optics to automotive to biomedical.• A single source document addressing everything from the sources of contamination to their removal and prevention.• Amply referenced and profusely illustrated.
Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9, part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods. This newest volume in the series discusses methods of surface cleaning of contaminants and the resources that are needed to deal with them. Taken as a whole, the series forms a unique reference for professionals and academics working in the area of surface contamination and cleaning. A strong theme running through the series is that of surface contamination and cleaning at the micro and nano scales. - Provides a comprehensive coverage of innovations in surface cleaning - Written by established experts in the surface cleaning field, presenting an authoritative resource - Contains a comprehensive review of the state-of-the-art, including case studies to enhance the learning process
.".. ALTECH 2003 was Symposium J1 held at the 203rd Meeting of the Electrochemical Society in Paris, France from April 27 to May 2, 2003 ... Symposium M1, Diagnostic Techniques for Semiconductor Materials and Devices, was part of the 202nd Meeting of the Electrochemical Society held in Salt Lake City, Utah, from October 21 to 25, 2002 ..."--p. iii.
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
