Experimental and Applied Mechanics represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Brazing processes offer enhanced control, adaptability and cost-efficiency in the joining of materials. Unsurprisingly, this has lead to great interest and investment in the area. Drawing on important research in the field, Advances in brazing provides a clear guide to the principles, materials, methods and key applications of brazing.Part one introduces the fundamentals of brazing, including molten metal wetting processes, strength and margins of safety of brazed joints, and modeling of associated physical phenomena. Part two goes on to consider specific materials, such as super alloys, filler metals for high temperature brazing, diamonds and cubic boron nitride, and varied ceramics and intermetallics. The brazing of carbon-carbon (C/C) composites to metals is also explored before applications of brazing and brazed materials are discussed in part three. Brazing of cutting materials, use of coating techniques, and metal-nonmetal brazing for electrical, packaging and structural applications are reviewed, along with fluxless brazing, the use of glasses and glass ceramics for high temperature applications and nickel-based filler metals for components in contact with drinking water.With its distinguished editor and international team of expert contributors, Advances in brazing is a technical guide for any professionals requiring an understanding of brazing processes, and offers a deeper understanding of the subject to researchers and engineers within the field of joining. - Reviews the advances of brazing processes in joining materials - Discusses the fundamentals of brazing and considers specific materials, including super alloys, filler metals, ceramics and intermetallics - Brazing of cutting materials and structural applications are also discussed
Experimental and Applied Mechanics, Volume 4 of the Proceedings of the 2015SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the fourth volume of nine from the Conference, brings together contributions to important areas of research and engineering. The collection presents early findings and case studies on a wide range of topics, including: Advanced Methods for Frontier Applications, Non-Homogeneous Parameters Identification, Teaching Experimental Mechanics in the 21st Century, Material Characterization and Testing, Mechanics of Interfaces Novel Applications of Experimental Mechanics
The most up-to-date coverage of welding metallurgy aspects and weldability issues associated with Ni-base alloys Welding Metallurgy and Weldability of Nickel-Base Alloys describes the fundamental metallurgical principles that control the microstructure and properties of welded Ni-base alloys. It serves as a practical how-to guide that enables engineers to select the proper alloys, filler metals, heat treatments, and welding conditions to ensure that failures are avoided during fabrication and service. Chapter coverage includes: Alloying additions, phase diagrams, and phase stability Solid-solution strengthened Ni-base alloys Precipitation strengthened Ni-base alloys Oxide dispersion strengthened alloys and nickel aluminides Repair welding of Ni-base alloys Dissimilar welding Weldability testing High-chromium alloys used in nuclear power applications With its excellent balance between the fundamentals and practical problem solving, the book serves as an ideal reference for scientists, engineers, and technicians, as well as a textbook for undergraduate and graduate courses in welding metallurgy.
A unique combination of the basic science and fundamental aspects of joints and interfaces with the engineering aspects of the subject. Contributors include researchers drawn from several Eastern European countries. Topics addressed include processing, interfacial reactions, graded joints, residual stress measurement and analysis, and failure and deformation. Audience: Academic and industrial researchers and ceramic manufacturers interested in understanding the current state of the art in joining.
