Metallic Films for Electronic, Optical and Magnetic Applications
Metallic Films for Electronic, Optical and Magnetic Applications

Author: Katayun Barmak

Publisher: Woodhead Publishing

Published: 2014-02-13

Total Pages: 671

ISBN-13: 085709629X

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Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties

Thin Films--stresses and Mechanical Properties X
Thin Films--stresses and Mechanical Properties X

Author: Sean G. Corcoran

Publisher:

Published: 2004

Total Pages: 616

ISBN-13:

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This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)

Thin Films Stresses and Mechanical Properties VI
Thin Films Stresses and Mechanical Properties VI

Author: William W. Gerberich

Publisher:

Published: 1997

Total Pages: 576

ISBN-13:

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Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.

Diffusion Processes in Advanced Technological Materials
Diffusion Processes in Advanced Technological Materials

Author: Devendra Gupta

Publisher: Springer Science & Business Media

Published: 2013-01-15

Total Pages: 552

ISBN-13: 9780080947082

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This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.

Surface Properties And Engineering Of Complex Intermetallics
Surface Properties And Engineering Of Complex Intermetallics

Author: Esther Belin-ferre

Publisher: World Scientific

Published: 2010-02-25

Total Pages: 408

ISBN-13: 9814465011

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This book is the third in a series of 4 books issued yearly as a deliverable of the research school established within the European Network of Excellence CMA (for Complex Metallic Alloys). It is written by reputed experts in the fields of surface physics and chemistry, metallurgy and process engineering, combining expertise found inside as well as outside the network.The CMA network focuses on the huge group of largely unknown multinary alloys and compounds formed with crystal structures based on giant unit cells containing clusters, with many tens or up to more than thousand atoms per unit cell. In these phases, for many phenomena, the physical length scales are substantially smaller than the unit-cell dimension. Hence, these materials offer unique combinations of properties, which are mutually excluded in conventional materials: metallic electric conductivity combined with low thermal conductivity, combination of good light absorption with high-temperature stability, combination of high metallic hardness with reduced wetting by liquids, electrical and thermal resistance tuneable by composition variation, excellent resistance to corrosion, reduced cold-welding and adhesion, enhanced hydrogen storage capacity and light absorption, etc.The series of books will concentrate on: development of fundamental knowledge with the aim of understanding materials phenomena, technologies associated with the production, transformation and processing of knowledge-based multifunctional materials, surface engineering, support for new materials development and new knowledge-based higher performance materials for macro-scale applications.

Thin Films - Stresses and Mechanical Properties X:
Thin Films - Stresses and Mechanical Properties X:

Author: Sean G. Corcoran

Publisher: Cambridge University Press

Published: 2014-06-05

Total Pages: 606

ISBN-13: 9781107409316

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Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.

Encyclopedia of Thermal Stresses
Encyclopedia of Thermal Stresses

Author: Richard B. Hetnarski

Publisher: Springer

Published: 2013-12-04

Total Pages: 0

ISBN-13: 9789400727380

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The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.