Official Gazette of the United States Patent and Trademark Office
Author: United States. Patent and Trademark Office
Publisher:
Published: 2001
Total Pages: 1436
ISBN-13:
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Qpedia Thermal Management – Electronics Cooling Book, Volume 2
Author: Advanced Thermal Solutions
Publisher: Advanced Thermal Solutions
Published: 2008
Total Pages: 206
ISBN-13: 0984627901
DOWNLOAD EBOOKThe complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Polyurethane Shape Memory Polymers
Author: W.M. Huang
Publisher: CRC Press
Published: 2011-09-08
Total Pages: 386
ISBN-13: 1439838003
DOWNLOAD EBOOKShape memory polymers (SMPs) are some of the most important and valuable engineering materials developed in the last 25 years. These fascinating materials demonstrate remarkably versatile properties—including capacity for actuation and stimulus responsiveness—that are enabling technologists to develop applications used to explore everything from the outer reaches of space to the inside of the human body. Polyurethane Shape Memory Polymers details the fundamentals of SMP makeup, as well as their shape-recovery features and their seemingly endless potential for use in applications ranging from the macro- to submicron scales. With an abundance of illustrations and vivid pictures to explain how SMPs and their composites work and how they can be used, this book covers: History and most recent developments in SMPs Thermomechanical properties and behavior of the polymers and their composites Modification of SMPs and novel actuation mechanisms Large-scale surface pattern generation Multi-shape memory effect Fabrication techniques Characterization of composites A must-have reference for anyone working in the materials science and engineering fields, this book outlines the properties—such as light weight, low cost, and ability to handle high strain—that make the easily processed SMPs so useful in fields including aerospace, biomedicine, and textiles. It is intended to help readers understand and apply the knowledge and techniques presented to develop new innovations that will further benefit society.
Advanced Computational Methods in Mechanical and Materials Engineering
Author: Ashwani Kumar
Publisher: CRC Press
Published: 2021-11-23
Total Pages: 343
ISBN-13: 1000483029
DOWNLOAD EBOOKThis book provides in-depth knowledge to solve engineering, geometrical, mathematical, and scientific problems with the help of advanced computational methods with a focus on mechanical and materials engineering. Divided into three subsections covering design and fluids, thermal engineering and materials engineering, each chapter includes exhaustive literature review along with thorough analysis and future research scope. Major topics covered pertains to computational fluid dynamics, mechanical performance, design, and fabrication including wide range of applications in industries as automotive, aviation, electronics, nuclear and so forth. Covers computational methods in design and fluid dynamics with a focus on computational fluid dynamics Explains advanced material applications and manufacturing in labs using novel alloys and introduces properties in material Discusses fabrication of graphene reinforced magnesium metal matrix for orthopedic applications Illustrates simulation and optimization gear transmission, heat sink and heat exchangers application Provides unique problem-solution approach including solutions, methodology, experimental setup, and results validation This book is aimed at researchers, graduate students in mechanical engineering, computer fluid dynamics,fluid mechanics, computer modeling, machine parts, and mechatronics.
The Electrical Engineering Handbook,Second Edition
Author: Richard C. Dorf
Publisher: CRC Press
Published: 1997-09-26
Total Pages: 2758
ISBN-13: 9781420049763
DOWNLOAD EBOOKIn 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.
Heat Transfer
Author: Younes Shabany
Publisher: CRC Press
Published: 2009-12-17
Total Pages: 526
ISBN-13: 1439814686
DOWNLOAD EBOOKThe continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Fine Pitch Surface Mount Technology
Author: Phil Marcoux
Publisher: Springer Science & Business Media
Published: 2013-11-27
Total Pages: 351
ISBN-13: 1461535328
DOWNLOAD EBOOKFine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Advanced Thermal Management Materials
Author: Guosheng Jiang
Publisher: Springer Science & Business Media
Published: 2012-09-14
Total Pages: 163
ISBN-13: 146141962X
DOWNLOAD EBOOKAdvanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Electronic Materials Handbook
Author:
Publisher: ASM International
Published: 1989-11-01
Total Pages: 1234
ISBN-13: 9780871702852
DOWNLOAD EBOOKVolume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Materials and Processes
Author: Barrie D. Dunn
Publisher: Springer
Published: 2015-12-29
Total Pages: 677
ISBN-13: 3319233629
DOWNLOAD EBOOKThe objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
