The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theoretical discussion covers heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data for use in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
This book introduces the fundamental concepts of inverse heat transfer problems. It presents in detail the basic steps of four techniques of inverse heat transfer protocol, as a parameter estimation approach and as a function estimation approach. These techniques are then applied to the solution of the problems of practical engineering interest involving conduction, convection, and radiation. The text also introduces a formulation based on generalized coordinates for the solution of inverse heat conduction problems in two-dimensional regions.
In the past decades, the scan rate range of calorimeters has been extended tremendously at the high end, from approximately 10 up to 10 000 000 °C/s and more. The combination of various calorimeters and the newly-developed Fast Scanning Calorimeters (FSC) now span 11 orders of magnitude, by which many processes can be mimicked according to the time scale(s) of chemical and physical transitions occurring during cooling, heating and isothermal stays in case heat is exchanged. This not only opens new areas of research on polymers, metals, pharmaceuticals and all kinds of substances with respect to glass transition, crystallization and melting phenomena, it also enables in-depth study of metastability and reorganization of samples on an 1 to 1000 ng scale. In addition, FSC will become a crucial tool for understanding and optimization of processing methods at high speeds like injection molding. The book resembles the state-of-the art in Thermal Analysis & Calorimetry and is an excellent starting point for both experts and newcomers in the field.
This book provides in-depth knowledge to solve engineering, geometrical, mathematical, and scientific problems with the help of advanced computational methods with a focus on mechanical and materials engineering. Divided into three subsections covering design and fluids, thermal engineering and materials engineering, each chapter includes exhaustive literature review along with thorough analysis and future research scope. Major topics covered pertains to computational fluid dynamics, mechanical performance, design, and fabrication including wide range of applications in industries as automotive, aviation, electronics, nuclear and so forth. Covers computational methods in design and fluid dynamics with a focus on computational fluid dynamics Explains advanced material applications and manufacturing in labs using novel alloys and introduces properties in material Discusses fabrication of graphene reinforced magnesium metal matrix for orthopedic applications Illustrates simulation and optimization gear transmission, heat sink and heat exchangers application Provides unique problem-solution approach including solutions, methodology, experimental setup, and results validation This book is aimed at researchers, graduate students in mechanical engineering, computer fluid dynamics,fluid mechanics, computer modeling, machine parts, and mechatronics.
The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.
Thermal control systems are an essential element of spacecraft design, ensuring that all parts of the spacecraft remain within acceptable temperature ranges at all times. Spacecraft thermal control describes the fundamentals of thermal control design and reviews current thermal control technologies. The book begins with an overview of space missions and a description of the space environment, followed by coverage of the heat transfer processes relevant to the field. In the third part of the book, current thermal control technologies are described, and in the final part, design, analysis and testing techniques are reviewed. - Provides background on the fundamentals of heat transfer which gives the reader a better understanding of the phenomenon and the way Space Thermal Control Systems work - Merges the experience of the authors in teaching aerospace engineering topics with the experience as compilers of the 'Spacecraft Thermal Control Design Data Handbook' of the European Space Agency and the development of in orbit thermal control systems for Spanish and ESA Missions - The engineering approach is enhanced with a full section on Thermal Control Design, Analysis and Testing
Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.
This book presents selected and peer-reviewed proceedings of the International Conference on Thermofluids (KIIT Thermo 2020). It focuses on the latest studies and findings in the areas of fluid dynamics, heat transfer, thermodynamics, and combustion. Some of the topics covered in the book include electronic cooling, HVAC system analysis, inverse heat transfer, combustion, nano-fluids, multiphase flow, high-speed flow, and shock waves. The book includes both experimental and numerical studies along with a few review chapters from experienced researchers, and is expected to lead to new research in this important area. This book is of interest to students, researchers as well as practitioners working in the areas of fluid dynamics, thermodynamics, and combustion.
