Silicon Device Processing
Silicon Device Processing

Author: Charles P. Marsden

Publisher:

Published: 1970

Total Pages: 472

ISBN-13:

DOWNLOAD EBOOK

The objective of the Symposium was to provide an opportunity for engineers and applied scientists actively engaged in the silicon device technology field to discuss the most advanced measurement methods for process control and materials characterization.The basic theme of the meeting was to stress the interdependence of measurements techniques, facilities, and materials as they relate to the overall problems of improving and advancing silicon device sciences and technologies.(Author).

Semiconductor Packaging
Semiconductor Packaging

Author: Andrea Chen

Publisher: CRC Press

Published: 2016-04-19

Total Pages: 216

ISBN-13: 1439862079

DOWNLOAD EBOOK

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

ESD in Silicon Integrated Circuits
ESD in Silicon Integrated Circuits

Author: E. Ajith Amerasekera

Publisher: John Wiley & Sons

Published: 2002-05-22

Total Pages: 434

ISBN-13:

DOWNLOAD EBOOK

* Examines the various methods available for circuit protection, including coverage of the newly developed ESD circuit protection schemes for VLSI circuits. * Provides guidance on the implementation of circuit protection measures. * Includes new sections on ESD design rules, layout approaches, package effects, and circuit concepts. * Reviews the new Charged Device Model (CDM) test method and evaluates design requirements necessary for circuit protection.