High c oxide superconductors such as Bi(Pb)-Sr-Ca-Cu-O (BSCCO) and Y-Ba-Cu-O (YBCO) systems are usually fabricated by sintering given mixtures of raw materials. Generally, sintering processing takes a longer heating time and the products are mechanically low strength and cannot be formed into complex shapes such as a coil, a curved fine tube or a fine rod. Another way to produce the ceramics is a glass-ceramic process in which the glasses prepared by melt-quenching are reheated for crystallization. A given mixture of raw materials in BSCCO is easily melted and quenched to form a given shape of glass, while that in YBCO is not glassified.This invaluable book has been written by authors from five countries. It presents a unique way to fabricate superconducting ceramics in BSCCO by glass-ceramic processing.
Since the discovery of high temperature superconductors, many new materials have been invented. In the last year, several new materials were also discovered, but their critical temperatures are still below lOOK. Precise physical and chemical work has made tremendous progress in the theoretical and experimental study of physical properties and carrier state characterizations. The de Haas van Alphen effect measurement showed the existence of a Fermi surface in YBCO. Flux dynamics is a well-known new problem in which flux creep and irreversibility line features are especially important for a fundamental understanding of the critical current and flux pinning. Flux pinning centers which are intentionally added using non-superconducting precipitates, neutrons, and protons, etc. increase critical currents to practical levels. The analysis of electric and magnetic properties are expected to reveal the pinning mechanism and also to further application development. As for wires and bulks, many melt-like sintering techniques have improved the material performance of critical current densities. A new seeding Quench-Melt Growth technique enlarged crystal size and increased the repulsion force. These melting processes, in conjunction with a mechanical strength improvement have been effectively introduced into wire fabrication in order to realize kilometer range wires and will put the oxide wires to practical use. Where thin film is con cerned, when many fabrication methods had been developed using the assistance effect of activated oxygen such as ozone and oxygen radicals, a high current 2 density of 106A/cm at 77K was reported.
This is the second volume of a four volume set intended to describe the techniques and applications of thermoanalytical and calorimetric methods. The general techniques and methodology are covered extensively in Volume 1, along with the fundamental physicochemical background needed. Consequently the subsequent volumes dwell on the applications of these powerful and versatile methods, while assuming a familiarity with the techniques.Volume 2 covers major areas of inorganic materials and some related general topics, e.g., catalysis, geochemistry, and the preservation of art. The chapters are written by established practitioners in the field with the intent of presenting a sampling of the how thermoanalytical and calorimetric methods have contributed to progress in their respective areas. The chapters are not intended as exhaustive reviews of the topics, but rather, to illustrate to the readers what has been achieved and to encourage them to consider extending these applications further into their domains of interest.- Provides an appreciation for how thermal methods can be applied to inorganic materials and processes.- Provides an insight into the versatility of thermal methods.- Shares the experiences of experts in a variety of different fields.- A valuable reference source covering a huge area of materials coverage.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
