Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
The printed circuit industry has achieved maturity and universal accep tance. No known interconnection technology threatens to render it obso lete in the foreseeable future. It offers two unique advantages that are important for any assembly technology: quality (reliability) and economy. The mode of component attachment to printed circuit boards, however, is undergoing a radical change. Technical and economic pressures are forcing the industry to convert some or all of its assembly to surface mounting techniques. We are moving away from the traditional large through-the-hole connection with its mechanical security. It is being re placed by a small surface butt and/or lap joint, sometimes with no added mechanical support to the solder. This change requires a complete reas sessment of design, production, and inspection techniques. A major por tion of this book is devoted to the changes imposed by surface mounting. This recent development is an extension of the established hybrid (thick and thin-film) industry. Yet when it is applied to conventional printed circuits, there are major differences. One must view the printed circuit board as a planar surface designed to provide interconnections between electronic devices. The electronic in dustry is using them for mass-production techniques to join discrete, integrated, and special components (leaded and leadless). This book ap plies to all board variations including single-sided, double-sided, multi layer, and flexible circuits.
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment
: This guide book has been prepared, based on my 35 + years’ experience on conducting training on Electronic PCB Assembly, both in the capacity of a Trainer and Consultant, solving assembly problems. I have realized that electronic manufacturing Industries, especially in MSME Sector, do not realize the fact that their system long term Reliability is a direct function of each Solder joint quality, and hence, a basic Induction training on soldering technique is absent from their HR Training Plan. Through this guide book, I have tried to share my experience with more than 300 Electronic Manufacturing Units in India, with a massage that if you wish to wish to produce Long Term Reliable System to your clients, please do not forget to emphasis on basic Manual Soldering. This book contains: 1. SOLDERING: INTRODUCTION AND BASIC THEORIES 2. SOLDERING MATERIALS (SOLDER, FLUX, CLEANING SOLVENT) 3. SOLDERING TOOLS 4. SOLDERING IRON & SOLDERING BITS 4. SAFETY PRECAUTIONS BEFORE STARTING SOLDERING PROCESS 6. STEP BY STEP SOLDERING PROCESS Part I: Through hole Component Part II: Surface Mount Devises 7.PWA INSPECTION TOOLS& EQUIPMENT 8. COMMON MANNUAL SOLDER JOINT DEFECTS & THEIR PREVENTION Annex-A: LEAD FREE SOLDERING Annex- B: BIBLOGRAPHY The book all also cover the Manual Soldering competitions, arranged by different Industry Association, like IPC.
Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
The advent of the emerging fifth generation (5G) networks has changed the paradigm of how computing, electronics, and electrical (CEE) systems are interconnected. CEE devices and systems, with the help of the 5G technology, can now be seamlessly linked in a way that is rapidly turning the globe into a digital world. Smart cities and internet of things have come to stay but not without some challenges, which must be discussed. The Handbook of Research on 5G Networks and Advancements in Computing, Electronics, and Electrical Engineering focuses on current technological innovations as the world rapidly heads towards becoming a global smart city. It covers important topics such as power systems, electrical engineering, mobile communications, network, security, and more. This book examines vast types of technologies and their roles in society with a focus on how each works, the impacts it has, and the future for developing a global smart city. This book is ideal for both industrial and academic researchers, scientists, engineers, educators, practitioners, developers, policymakers, scholars, and students interested in 5G technology and the future of engineering, computing, and technology in human society.
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
