SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices
SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices

Author: David Harame

Publisher: The Electrochemical Society

Published: 2008

Total Pages: 1136

ISBN-13: 1566776562

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Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices
SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices

Author: D. Harame

Publisher: The Electrochemical Society

Published: 2010-10

Total Pages: 1066

ISBN-13: 1566778255

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Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

ULSI Process Integration 6
ULSI Process Integration 6

Author: C. Claeys

Publisher: The Electrochemical Society

Published: 2009-09

Total Pages: 547

ISBN-13: 1566777445

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ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).

Nanoscaled Films and Layers
Nanoscaled Films and Layers

Author: Laszlo Nanai

Publisher: BoD – Books on Demand

Published: 2017-05-24

Total Pages: 300

ISBN-13: 9535131435

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In recent years, scientific investigations and technological developments have resulted in many new results. Direct applications of quantum mechanical laws to system with length scales lower than 100 nm (nano) had opened a way to construction of new equipment in the field f.e. of nano- and optoelectronics. This book fits into this trend summarizing the results related to discoveries and technological applications of nanolayer in different fields of material science and even life science. The chapters are organized into three subfields: 1) Preparation and fabrications of nanolayers with different methods. 2) Description of recent achievements related to very important III-V heterostructures. 3) Descriptions of mechanical, thermal, optoelectronic, photocatalytic, and tribological properties of nanolayered structures. Some environmentally friendly applications are also treated in this book. The presented book provides a description of specific and original results obtained by authors. We hope that the volume will be of interest for a wide range of readers working in the field of material science.

Sinep 2009. 1st International Workshop on Si Based Nano-Electronics and -Photonics
Sinep 2009. 1st International Workshop on Si Based Nano-Electronics and -Photonics

Author: Steafno Chiussi

Publisher: Netbiblo

Published: 2009-06

Total Pages: 162

ISBN-13: 8497454162

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The main objective of this International Workshop in Vigo is to target this major problem by bringing together scientists and engineers specialized on various different topics related to group IV semiconductors. In five consecutive sessions dedicated to - Group IV materials: CMOS and further extension of the roadmap - Group IV materials: Nano-photonics - Material aspects and characterization on nano-scale - Nanostructures and material processing on atomic scale

Processing and Properties of Compound Semiconductors
Processing and Properties of Compound Semiconductors

Author:

Publisher: Elsevier

Published: 2001-10-20

Total Pages: 333

ISBN-13: 0080541011

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Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded.

Advances in Chemical Mechanical Planarization (CMP)
Advances in Chemical Mechanical Planarization (CMP)

Author: Babu Suryadevara

Publisher: Woodhead Publishing

Published: 2021-09-10

Total Pages: 650

ISBN-13: 0128218193

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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP